An electronic device may include a mechanical structure that mechanically supports the electronic device. One or more traces may be formed on one or more surfaces of the mechanical structure. Other electrical components may also be mounted on the surface of the mechanical structure and may or may not be connected to one or more of the traces. Additionally, one or more passivation layers may be formed on one or more of the surfaces, traces, and/or other electrical components and one or more traces and/or other electrical components may be intermixed with such passivation layers. In this way, the mechanical structure may be operable to function as an electrical component of the electronic device.

A manufacturing process for forming a touch structure utilizes a first anti-etching optical layer to define the electrodes pattern and utilizes a second anti-etching optical layer to define the traces pattern. The first anti-etching optical layer and the second anti-etching optical layer do not need to be removed. The refractive index of the first anti-etching optical layer and the refractive index of the second anti-etching optical layer can be adjusted to reduce the display difference between the etched region and the non-etched region.

According to one embodiment, a flexible substrate includes an insulating base material including an island-shaped portion, a first portion having a band shape and connected to the island-shaped portion, and a second portion having a band shape and connected to the island-shaped portion, and a wiring layer provided on the insulating base material. The first portion includes a first curved portion and a first straight portion connecting the island-shaped portion and the first curved portion, and the second portion includes a second curved portion and a second straight portion connecting the island-shaped portion and the second curved portion.

A wiring board includes a plurality of first terminal parts for electrically connecting with a control circuit and disposed corresponding to a plurality of first electrode parts, and first terminal wiring parts for electrically connecting the plurality of first electrode parts and the corresponding first terminal parts. Each of the first terminal wiring parts has, in at least a portion thereof falling in a circle with a radius of 10 mm centering around a boundary part between the first terminal wiring parts and the corresponding first terminal parts, a portion having a line width of 5 μm to 100 μm inclusive, the wiring resistance value of the first terminal wiring parts connected to the first terminal parts being 100 ohms to 10 kohms inclusive.

A method for fabricating an interconnect function array includes forming a first plurality of conductive lines on a substrate, forming an insulator layer over the first plurality of conductive lines and the substrate, removing portions of the insulator layer to define cavities in the insulator layer that expose portions of the substrate and the first plurality of conductive lines, wherein the removal of the portions of the insulator layer results in a substantially random arrangement of cavities exposing portions of the substrate and the first plurality of conductive lines, depositing a conductive material in the cavities, and forming a second plurality of conductive lines on portions of the conductive material in the cavities and the insulator layer.

A first ground elimination portion 3a formed in a ground layer is formed in a size such that a characteristic impedance determined by the first ground elimination portion 3a and component pads 1a is higher than a characteristic impedance determined by a ground conductor 2a and a transmission line 1b. When an outer shapes of the component pads 1a are projected on the ground layer, the center of a region interposed between the conductor pads 1a is positioned at the center of the first ground elimination portion 3a.

A system, method and computer program product for automated circuit trace generation and reconfiguration on a breadboard, includes a breadboard having a plurality of contact points; a switching matrix coupled to the contact points of the breadboard, and connected to a computer. The switching matrix is programmed by the computer to generate one or more circuit traces onto the contact points of the breadboard.

A light assembly and method of forming light assemblies includes a flexible light layer, a thermoplastic housing, and an IMC layer. The flexible light layer has a flexible substrate, a printed circuit, and a plurality of LEDs extending outward from the flexible substrate. The IMC layer is formed opposite the flexible light layer from the thermoplastic housing and covers the LEDs. Forming may include placing the flexible light layer within a mold cavity, injecting the thermoplastic structure on one side of the flexible light layer, and injecting the IMC layer on the opposite side of the flexible light layer from the thermoplastic structure. Injecting the thermoplastic structure into the mold cavity may change the shape of the flexible light layer. Datum features of the flexible light layer may align the thermoplastic structure relative to the datum features.

A digitizer including a flexible printed circuit film including a folding area configured to be folded, and having a first surface and a second surface opposite to the first surface, a plurality of first lines disposed on the first surface of the flexible printed circuit film and extending in a first direction, and a plurality of second lines disposed on the second surface of the flexible printed circuit film and extending in a second direction crossing the first direction, in which the first lines and the second lines define a grid area overlapping the folding area on a plane, and the flexible printed circuit film includes a penetration hole in the grid area.

An apparatus and method simulates cable routing for determining signal integrity between electronic components within a computer chassis. The apparatus includes a base plate simulating a computer chassis base. The base plate includes a top surface. A plurality of reconfigurable mounting fixtures each allow temporary mounting of a printed circuit board assembly (PCBA) to a respective reconfigurable mounting fixture. The plurality of reconfigurable mounting fixtures is temporarily mountable anywhere on the top surface of the base plate. A cable including a first end connector allows a connection to a first PCBA, and a second end connector allows a connection to a second PCBA.