An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.

A lighting strip has a printed circuit board with one or more perforated lines at which the printed circuit board length may be adjusted by breaking off an end portion of the printed circuit board. A first layer has a first set of conductive tracks and a second layer has a second set of conductive tracks corresponding to the first set of conductive tracks. Each conductive track of the second set is vertically aligned and positioned over the corresponding conductive track of the first set. An array of contact terminals is provided on a third layer. A plurality of lighting elements is disposed along the lighting strip, each electrically connected to a respective pair of the contact terminals. The lighting strip further comprises a set of vias connecting each conductive track of the first set to the corresponding conductive track of the second set.

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

The present invention describes a work vehicle component comprising a cavity obtained in the component, having an extension axis and delimited by a side wall, an opening for the cavity, placed at an outer surface of the component, a wear sensor housed in the cavity and comprising a first axial end placed at the opening for the cavity, a support body inserted into the cavity with a first axial end aligned with the first axial end of the wear sensor. The support body is connected to the side wall of the cavity and constrained to the side wall of the cavity, and the wear sensor is physically connected to the support body and is constrained, at least in an axial direction, to the support body.

A printed wiring board includes a first resin insulating layer, a conductor layer on the first resin insulating layer, and a second resin insulating layer formed on the first resin insulating layer such that the second resin insulating layer is covering the conductor layer. The conductor layer includes a first circuit having a width of 15 μm or less and a rectangular cross-sectional shape, a second circuit having a trapezoidal cross-sectional shape, a third circuit, a fourth circuit, a fifth circuit, and a sixth circuit, a space between the first and third circuits has a width of 14 μm or less, a space between the first and fourth circuits has a width of 14 μm or less, a space between the second and fifth circuits has a width of 20 μm or more, and a space between the second and sixth circuits has a width of 20 μm or more.

In an interposer, metal bodies are included in a resin layer and separated from each other. A dimension of each of the metal bodies in an upward-downward direction is greater than a dimension of each of the plurality of metal bodies in a direction orthogonal to the upward-downward direction. At least one of the metal bodies is located in a first electrode and at least one of the plurality of metal bodies is located in a second electrode to electrically couple together the first electrode and the second electrode.

In accordance with various embodiments, lighting systems features multiple inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels features one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers, first inner electrodes, and second inner electrodes stacked on one another, a first outer electrode electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The multilayer body includes first and second side surfaces respectively including first and second recesses where a midsection of each of the first and second side surfaces in a length direction is recessed inward in a width direction. When the multilayer ceramic capacitor is viewed in a stacking direction, a dimension of each of the first and second recesses in the length direction is smaller on an inner side than on an outer side in the width direction.

There is provided a semiconductor apparatus including a memory controller; a CPU; a high-speed communication controller; a memory operation terminal group that includes a plurality of memory operation terminals for inputting a first signal propagating between an external memory group and the memory controller; a high-speed communication terminal group that includes a plurality of high-speed communication terminals for inputting a second signal to the high-speed communication controller; an inspection terminal group that includes a plurality of inspection terminals for acquiring information from the CPU and performing debugging; and a terminal mounting surface at which the memory operation terminal group, the high-speed communication terminal group, and the inspection terminal group are provided, in which at the terminal mounting surface, a first inspection terminal among the plurality of inspection terminals is located between the memory operation terminal group and the high-speed communication terminal group.

Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region.