A cable harness supplies a plurality of electric devices which are in a distributed arrangement in a device housing. A first connection point of the cable harness has a plug connector on the side of the cable harness. At least the electric devices which are supplied via the first connection point are connected to the first plug connector on the side of the cable harness by way of a device-side plug connector and an adapter that is plugged together with both plug connectors.

A lighting strip has a printed circuit board with one or more perforated lines at which the printed circuit board length may be adjusted by breaking off an end portion of the printed circuit board. A first layer has a first set of conductive tracks and a second layer has a second set of conductive tracks corresponding to the first set of conductive tracks. Each conductive track of the second set is vertically aligned and positioned over the corresponding conductive track of the first set. An array of contact terminals is provided on a third layer. A plurality of lighting elements is disposed along the lighting strip, each electrically connected to a respective pair of the contact terminals. The lighting strip further comprises a set of vias connecting each conductive track of the first set to the corresponding conductive track of the second set.

The present invention describes a work vehicle component comprising a cavity obtained in the component, having an extension axis and delimited by a side wall, an opening for the cavity, placed at an outer surface of the component, a wear sensor housed in the cavity and comprising a first axial end placed at the opening for the cavity, a support body inserted into the cavity with a first axial end aligned with the first axial end of the wear sensor. The support body is connected to the side wall of the cavity and constrained to the side wall of the cavity, and the wear sensor is physically connected to the support body and is constrained, at least in an axial direction, to the support body.

A cable harness supplies a plurality of electric devices which are in a distributed arrangement in a device housing. A first connection point of the cable harness has a plug connector on the side of the cable harness. At least the electric devices which are supplied via the first connection point are connected to the first plug connector on the side of the cable harness by way of a device-side plug connector and an adapter that is plugged together with both plug connectors.

An interposer array is provided, which includes an array substrate, a first interposer configured as a closed curve having a first space therein, a second interposer configured as a closed curve having a second space therein, a plurality of first bridges configured to connect the array substrate and the first interposer, and a plurality of second bridges configured to connect the first interposer and the second interposer.

A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

A system and method for disabling the Wi-Fi on a handheld console whereby the handheld console may have an integrated chip that is a ball grid array whereby each solder ball provides certain voltages or data signals whereby the approach will be determined based on the specific handheld console as well as other factors including new manufacturer integrated chips, chipset architecture, software/firmware changes, or where is the best location on the handheld console for each circuit line to apply the short cut for the circuit to not be completed by either diverting the signal to another location on the logic board such as ground or creating an open line.

According to an embodiment of the present disclosure, a structure constructed by a sheet includes a sheet body. The sheet body has a plurality of enclosed paths. A plurality of slits and connection portions are arranged along each enclosed path. Each connection portion is located between two adjacent slits. The sheet body is flexible. In an extended state, the slits form extended openings. At least one extended opening is a symmetric opening, so that the sheet body is extended to form a structure constructed by sheet. The structure constructed by sheet forms a stereoscopic curved surface, and the plurality of connection portions is located on a plurality of contours of the stereoscopic curved surface.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.