A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.

This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, the fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.

A circuit board and a battery connection module are provided. The circuit board has an insulating substrate and a plurality of circuit traces provided thereto. At least one of the traces is provided with a fuse unit. The fuse unit has a main fuse and at least one spare fuse. The main fuse has two main trace connection end portions respectively positioned at two ends of the main fuse and connected to the trace and a main fuse section connected between the two main trace connection end portions. The spare fuse has two trace connection end portions respectively positioned at two ends of the spare fuse and a fuse section connected between the two trace connection end portions, the fuse section and the main fuse section are spaced apart from each other and arranged side by side, and at least one of the two trace connection end portions is not connected with the trace so as to form an electrical disconnection with the trace, and after the main fuse section forms an electrical disconnection, the two trace connection end portions are connected to the trace so that a current conductive path is formed by the spare fuse and the trace.

In a customizable circuit an interconnect matrix is provided that includes only two conductive layers, the matrix defining a first layer of L-shaped conductive lines and a second layer of substantially L-shaped conductive line segments that are connected to electrical components.

In one aspect, a system component includes a printed circuit (PC) board on which plural conductive ink segments are disposed. The system component also includes a sealed housing that houses the PC board. The plural conductive ink segments define a bit pattern to establish a key.

A flexible thin sheet-shaped electric wire includes: a body part having electrical insulation; and a conductor part that is arranged in the body part. Further, the conductor part includes a conductor body, and a fuse part that is formed in a part of the conductor body and of which a cross-sectional area is smaller than a cross-sectional area of the conductor body. Still further, the body part includes a conductor region in which the conductor body is arranged and a fuse region in which the fuse part is arranged. The fuse part includes an enclosing part that is arranged to enclose the entire circumference of at least a part of the fuse region.

A diagonally cuttable LED strip system comprising of a channel having a bottom and one or more side walls and a lens in which a primary circuit board having one or more LED diodes, one or more resistors, and one or more cutting lines resides therein. The one or more cutting lines include perpendicular and non-perpendicular cutting lines which divide the channel into cuttable increments at one or more angles. An extender is provided which attaches to the end of a channel to allow the cuttable increments of the channel to be extended, shortened, or a combination thereof.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.