Patent classifications
H05K1/0326
METHOD AND SYSTEM FOR TRANSFER PRINTING OF FILMS
The capillary transfer technology presented here represents a powerful approach to transfer soft films from surface of liquid onto a solid substrate in a fast and defect-free manner. The fundamental theoretical model and transfer criteria validated with comprehensive experiments and finite element analyses, for the first time provides a quantitative guide and optimization for the choice of material systems, operating conditions and environments for scalable on-demand transfers with high yield. The intrinsically moderate capillary transfer force and externally selectable transfer direction offer robust capabilities for achieving deterministic assembly and surface properties of structures with complex layouts and patterns for potentially broad applications in the fabrication of flexible/stretchable electronics, surface wetting structures and optical devices. Integration of this technology with other advanced manufacturing technologies associated with material self-assembly, growth and layout alignment represents promising future topics and would help create emerging new manufacturing technologies that leverage unique fluidity of liquid environments.
METHOD FOR PRODUCING CONDUCTOR, CONDUCTOR PRODUCING APPARATUS, AND STRUCTURE
Embodiments of the present invention provide a method for producing a conductor. The method includes: applying a resin forming composition containing a polymerizable compound and a solvent on a substrate; polymerizing the polymerizable compound in the applied resin forming composition to form a resin structure that is porous on the substrate; and applying a conductor forming composition containing at least one selected from the group consisting of metal oxide particles and metal particles on the resin structure.
EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the epoxy resin is partially or fully an epoxy resin represented by the following general formula (1). Each R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, each R.sup.2 represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; and m represents a number of 0 to 5.
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METHOD FOR PRODUCING ELECTRICAL CIRCUITRY ON FILLED ORGANIC POLYMERS
Electrical circuitry is produced on the surface of an organic polymer. The electrical circuitry is produced on a support, and a polymerizable composition is brought into contact with the support and the circuitry. The polymerizable composition is polymerized while in contact with support and the circuitry to produce a solid, organic polymer. The electrical circuitry becomes adhered to and partially embedded in a surface of the solid organic polymer. The support may be removed subsequent to the polymerization step to expose the circuitry at the surface of the solid organic polymer.
Capacitive leadwire for physiological patient monitoring
A leadwire for physiological patient monitoring is provided that transfers potentials received at a chest electrode to a data acquisition device. The leadwire includes an electrode end connectable to the chest electrode and a first conductive layer extending from the electrode end. The leadwire also has a device end connectable to a data acquisition device and a second conductive layer extending from the device end. The first conductive layer is galvanically isolated from the second conductive layer such that the first conductive layer and the second conductive layer form a capacitor.
Active ester resin and composition and cured product using the same
The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.
Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition
The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.
Circuit-including film
A circuit-including film comprising: a resin film (1); and a conductive fine wire circuit (A) and a conductive circuit (B) independent of the conductive fine wire circuit (A), which are arranged on one surface of the resin film (1), wherein the resin film (1) contains at least one resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin and an ethylene-(vinyl acetate) copolymer resin.
RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD
An aspect of the present invention is a resin composition, which contains a polyphenylene ether compound, a curing agent, boron nitride, and an inorganic filler other than the boron nitride, in which the content of boron nitride is 15 to 70 parts by volume with respect to 100 parts by volume of the sum of the polyphenylene ether compound and the curing agent.
Backlit user interface
An user interface device includes a lens with a top surface and a bottom surface, where the bottom surface includes at least one graphic that is visible through the top surface of the lens. The user interface device further includes a transparent circuit film with a top surface and a bottom surface, at least one light emitting diode (LED), at least one silver conductor, and a layer of transparent pressure-sensitive adhesive that secures the bottom surface of the lens to the top surface of the transparent circuit film.