The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.

A pure copper sheet has a composition including 99.96 mass% or more of Cu, 9.0 mass ppm or more and less than 100.0 mass ppm of a total content of Ag, Sn, and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 .Math.m or more, the pure copper sheet has crystals in which crystal planes parallel to the rolled surface are a {022} plane, a {002} plane, a {113} plane, a {111} plane, and a {133} plane, and diffraction peak intensities of the individual crystal planes that are obtained by X-ray diffraction measurement by a 2θ/θ method on the rolled surface satisfy I {022}/(I {022} + I {002} + I {113} + I {111} + I {133}) ≤ 0.15, I {002}/I {111} ≥ 10.0, and I {002}/I {113} ≥ 15.0.

A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the electronic part 14 is to be bonded) of the metal plate 10 of copper, or aluminum or the aluminum alloy (when a plating film 20 of copper is formed on the surface), the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 μm, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating film 20 of copper) to arrange the electronic part 14 thereon to sinter silver in the silver paste to form a silver bonding layer 12 to bond the electronic part 14 to the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) with the silver bonding layer 12.

Provided is a substrate having dielectric strength and light reflectivity, as well as excellent mass productivity. A substrate (10) for mounting a light-emitting element (20) thereon includes a base (12) and an insulation layer (30) disposed directly or indirectly on a surface of the base (12). The insulation layer (30) includes a reflection layer (32) that reflects light and a mesh glass sheet 31 that is disposed within the reflection layer (32) and that has a coefficient of linear expansion smaller than that of the reflection layer (32).

Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate (20) for a light emitting device includes: a first insulating layer (11) having thermal conductivity which is formed on a surface of one side of a metal base (2); a wiring pattern (3) which is formed on the first insulating layer (11); and a second insulating layer (12) having light reflectivity which is formed on the first insulating layer (11) and on some parts of the wiring pattern (3), so that some parts of the wiring pattern (3) are exposed, in which the first insulating layer (11) is a layer of ceramic formed by thermal spraying.

A printed circuit board has a core made of an aluminum material; a bonding member positioned on opposite surfaces of the core; a base layer bonded to the opposite surface of the core through the bonding member; a receiving hole extending through the core, the bonding member, and the base layer; a zinc substitution layer positioned on a surface of the base layer and a portion of the base layer exposed on an inner surface of the receiving hole; and a plating layer positioned on the zinc substitution layer, and having a circuit pattern.

A second lead frame is set onto a conductive layer and a busbar. The second lead frame has holes previously formed at opposite ends thereof, and pieces of solder material or solder pieces are inserted into the holes. Then, the solder pieces are vibrated by an ultrasonically vibrating tool, whereby the solder pieces are melted without having a high temperature. The second lead frame is thus bonded to the conductive layer and the busbar. A semiconductor element and the busbar are connected by a first lead frame and the second lead frame. The connection structure thereof is such that the second lead frame to be bonded by ultrasonic bonding or other bonding methods is not directly in contact with the semiconductor element, which eliminates the risk of damage to the semiconductor element.

An illumination device including an LED mounting platform (2) having a peripheral region (2a) and a relatively inner region (2b); at least one warm white LED (3) and at least one cool white LED (4) mounted adjacent the peripheral region (2a) of the LED mounting platform (2), and, at least one RGB LED (5) mounted adjacent the relatively inner region (2b) of the LED mounting platform (2); a diffusion cover (10) configured to allow light emitted from the at least one warm white LED (3), the at least one cool white LED (4), and the at least one RGB LED (5) to pass therethrough; and wherein at least one light emission characteristic of light emitted from the at least one warm white LED (3), the at least one cool white LED (4), and/or the at least one RGB LED (5) is configured to be selectably varied in response to an input control signal so as to produce a plurality of lighting modes.

In a light-emitting device (30), a wiring pattern including conductor wirings (160, 165) and electrodes (170, 180) is formed on a substrate (110), and an Au layer (120) is formed on the wiring pattern.