An embodiment of the present invention is an IC chip mounting apparatus includes: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material, the antenna continuous body having an adhesive and an IC chip placed at a reference position of each of the antennas; a measurement unit configured to measure an interval between adjacent two of the antennas of the antenna continuous body; a press unit moving machine configured to sequentially feed out press units each having a pressing surface, from a waiting position, to move each of the press units along the conveying surface; and a controller configured to control timing of feeding out each of the press units from the waiting position based on the interval measured by the measurement unit, so that the pressing surface of each of the press units presses a predetermined region containing the reference position of each of the antennas on the conveying surface.

A suction nozzle assembly used in manufacture for the gentlest handling of delicate components such as a camera lens includes a suction nozzle rod and a suction nozzle member. The suction nozzle rod includes a first through hole. The suction nozzle member includes a main body and a suction nozzle located on both sides of the main body. The main body includes a second through hole connected to the first through hole, and a third through hole connected to the second through hole. The suction nozzle includes at least one suction nozzle hole connected to the third through hole. The disclosure also provides a suction device having the suction nozzle assembly.

The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.

A mounting device comprises: a mounting head having multiple pickup members configured to pick up components; a mounting control section configured to cause a second component to be picked up later when a first component, held by the mounting head at a predetermined height, and the second component, held by the mounting head at a lowered position lower than the predetermined height, are picked up with the mounting head; the mounting control section being configured to cause the second component to be released earlier when the mounting head, having picked up the first component and the second component, releases a component.

Provided is an image processing method for easily viewing images obtained by imaging multiple components at a time, the method including image capturing processing of capturing each component holding state relating to multiple suction nozzles mounted on a mounting head as one image, image dividing processing of dividing a region relating to a predetermined component holding state for image data of the multiple component holding states obtained by the image capturing processing, direction conversion processing of converting a direction of the component holding state for divided image data divided by the image dividing processing, and display processing of displaying an image based on the divided image data subjected to the direction conversion processing.

A shaft drive device includes a plurality of shafts each retained in a raisable and lowerable manner; a return spring for urging each of the shafts upward; an actuating member contactable with a pressed part of any one of the shafts for raising and lowering a selected shaft; and a raising and lowering mechanism which changes a posture of the actuating member between a first posture of coming into contact with the pressed part of the shaft and pressing the pressed part to lower the shaft against an urging force of the return spring and a second posture of releasing the pressing. The pressed part of the shaft is made of ferromagnet, and the actuating member is given a magnetic force.

The present invention provides a mounting tool tip arranged for being releasably mounted to mounting tool of a component mounting machine, said mounting tool being rotatably arranged in said component mounting machine around a vertical rotational axis. The mounting tool tip comprises a tip portion at a first end and arranged for engagement with a component to be mounted in a component mounting machine; engagement means for mounting said mounting tool tip to said mounting tool. Further, the engagement means is arranged at a second end opposite said first end and further configured such that said tip portion is off-center in a horizontal direction compared to said rotational axis when the mounting tool tip is mounted to said mounting tool. The present invention further provides a mounting tool, a mount head, a component mounting machine as well as method for simultaneously picking at least two components arranged in adjacent component tapes in a component mounting machine.

A component mounting machine includes a head having multiple pickup members, a moving device for moving the head, at least one feeder, and a control device. The feeder is configured to receive correction values for sets of the multiple pickup members, set a target feeding amount for the number of sets based on the received correction values for the number of sets, and sequentially feed components for the number of sets in a predetermined direction with each set target feeding amount. The control device is configured to acquire a positional deviation amount of the multiple pickup members in the predetermined direction for each set, and transmit the correction values for the number of sets based on the acquired positional deviation amount for the number of sets to the feeder so that the feeder collectively receives the correction values for the number of sets at a predetermined timing.

A pick arm for a pick and place apparatus for electronic devices has a main body having a proximal end whereat the pick arm is mountable onto a pick arm support, and a distal end at which a collet is mounted for holding an electronic device. A first rigid body is located adjacent to the proximal end of the pick arm and a second rigid body is located adjacent to the distal end of the pick arm. The first and second flexures connect the first rigid body to the second rigid body. Moreover, the first flexure is spaced from the second flexure, and the first and second flexures have opposing faces that are arranged substantially parallel to each other. An actuator is operative to apply a biasing force onto the second rigid body so as to bend the first and second flexures relative to the first rigid body for biasing the collet of the pick arm to move.

A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.