A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.

The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

There is provided a pallet replacing device configured to be applied to a component supply device in which pallets, each holding components, are individually stored in multiple storage slots which are formed at predetermined heightward intervals inside a magazine, and the pallets are selectively drawn out to supply the components, the pallet replacing device, including a main body case, multiple replacing slots formed at the predetermined heightward intervals inside the main body case and configured to store the pallets therein, a positioning section configured to position the main body case in a predetermined position where the multiple pallets can individually move between the storage slots and the replacing slots, and a moving tool configured to be used for a batch moving operation for moving the multiple pallets altogether at one time between the storage slots and the replacing slots.

A tray is automatically mounted on a pallet. A tray handling device, which handles a tray collected from a component mounting device configured to mount a component held in a tray on a substrate, includes: a pallet collecting unit configured to take out a pallet on which the tray is mounted from a magazine collected from the component mounting device; and a tray unloading unit configured to unload the tray from the collected pallet.

A method in an automated Surface Mount Device (SMD) warehouse configured to store bins at predetermined positions within said automated Surface Mount Device (SMD) warehouse, the method comprising receiving a bin at a port of said automated Surface Mount Device (SMD) warehouse and scanning an identity tag attached to said bin to obtain a bin ID.

Provided is an electronic component supply system determining the types of electronic components installed on component pallets at a time when the electronic components are installed on the component pallets for installation, which determines the types of the electronic components installed on the component pallets based on planned multiple jobs continuously performed by multiple electronic component mounting machines to which the component pallets are attached and an execution order for the jobs such that the number of the component pallets exchanged during job switching is minimized.

For a component receiving member provided with a component reception recess shaped according to a component that is a storage target, and side wall section that a component held by suction nozzle contacts when moved in the left-right direction, when the component is released in a state contacting the side wall section, the component is stored in the component reception recess by leads of the component falling along a tapered surface and the component rotating 90 degrees due to its own weight. Therefore, even in a case in which the component is held by suction nozzle with an upper surface facing up, the component is stored in the component reception recess with the upper surface facing up by the component rotating 90 degrees at the component receiving member.

An electronic component supply device, comprising: a tape feeder configured to feed out a taped electronic component and supply an electronic component; and a holding mechanism arranged to handle the tape feeder and configured to hold a container for accommodating the taped electronic component supplied to the tape feeder, in which the holding mechanism is configured to hold the container having a width larger than the width of the tape feeder.

This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

A manufacturing system according to the present disclosure includes one or more manufacturing apparatuses, a carrier, and a control system. Each of the one or more manufacturing apparatuses performs predetermined work on a board. The carrier carries a burden. The control system controls carrying work by the carrier. The burden includes a plurality of functional modules. Each of the plurality of functional modules provides a predetermined function for the one or more manufacturing apparatuses. The carrier includes a coupling portion to be coupled to any of the plurality of functional modules. The control system has at least one functional module, selected from the plurality of functional modules and coupled to the coupling portion, carried by the carrier.