Transfer material supply units for supplying a transfer material to a transfer table and spreading the transfer material is set in a component mounting machine, and transfer pins for transferring the transfer material to a mounting surface of a three-dimensional board are held by at least one mounting head of the component mounting machine to be exchangeable with a suction nozzle for picking up a circuit component. The lower end of the transfer pin is immersed in the transfer material on the transfer table to attach the transfer material to the lower end of the transfer pin by moving the mounting head holding the transfer pin to a position above the transfer table to lower and raise the transfer pin, and then the transfer material attached to the lower end of the transfer pin is transferred to the mounting surface.

A dispensing system includes a frame, a support coupled to the frame, a dispensing unit configured to dispense viscous material, and a gantry assembly coupled to the frame. The gantry assembly includes a gantry configured to support the dispensing unit and to move the dispensing unit in x-axis, y-axis and z-axis directions and a tilt and rotate subassembly configured to tilt and rotate the dispensing unit. The dispensing system further includes a controller configured to control dispensing unit and the gantry assembly to perform a dispense operation on the electronic substrate. The controller is configured to control the dispensing unit to dispense material from the nozzle of the dispensing unit at a flow rate configured to deposit a desired amount or density of material on the electronic substrate along a three-dimensional path.

A dispensing system includes a frame, a support coupled to the frame, a dispensing unit configured to dispense viscous material, and a gantry assembly coupled to the frame. The gantry assembly includes a gantry configured to support the dispensing unit and to move the dispensing unit in x-axis, y-axis and z-axis directions and a tilt and rotate subassembly configured to tilt and rotate the dispensing unit. The dispensing system further includes a controller configured to control dispensing unit and the gantry assembly to perform a dispense operation on the electronic substrate. The controller is configured to simultaneously coordinate the movement of the gantry assembly and the tilt and rotate subassembly to position and orient the nozzle of the dispensing unit a predetermined distance and orientation from the electronic substrate while dispensing material along a three-dimensional path.

An embodiment of the present invention is an IC chip mounting apparatus includes: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material, the antenna continuous body having an adhesive and an IC chip placed at a reference position of each of the antennas; a measurement unit configured to measure an interval between adjacent two of the antennas of the antenna continuous body; a press unit moving machine configured to sequentially feed out press units each having a pressing surface, from a waiting position, to move each of the press units along the conveying surface; and a controller configured to control timing of feeding out each of the press units from the waiting position based on the interval measured by the measurement unit, so that the pressing surface of each of the press units presses a predetermined region containing the reference position of each of the antennas on the conveying surface.

The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.

A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.

An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.

An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.

Precisely aligned assemblies can be complex, time consuming, labor intensive, and expensive and a need exists for better alternatives. Systems and methods described herein yield high precision printed circuit board assemblies (PCBAs) that contain pre-built alignment features to address this need. The work of precisely locating components on the PCBA to a final position in the overall assembly is already built in to the board. Locating features are used to precisely position one or more components, such as optical components, electro optical components, or mechanical components in assemblies. The locating features may be used to constrain the positions of those components, such as by kinematic coupling, solder wetting dynamics, semiconductor cleaving, dicing, photolithographic techniques for etching, constant contact force, and advanced adhesive technology to result in optical level positioning that significantly improves or eliminates assembly alignment challenges.

An application method for applying an adhesive to an object includes applying, prior to applying the adhesive to a specified part of the object, the adhesive to a part different from the specified part, calculating an application quantity of the adhesive applied to the part different from the specified part, making a first correction configured to correct an application condition of the adhesive based on basis of a result of the calculation, and applying the adhesive to the specified part using the application condition corrected in the first correction.