The present invention is an IC chip mounting apparatus for mounting an IC chip at a reference position of an inlay antenna while conveying the antenna, the IC chip mounting apparatus including: a nozzle configured to suck an IC chip when located at a first position and to place the IC chip at the reference position of the antenna when located at a second position; a nozzle attachment to which the nozzle is attached; an image acquisition unit configured to acquire an image of the IC chip sucked by the nozzle; and a correction amount determination unit configured to determine correction amounts for the IC chip sucked by the nozzle, based on the image acquired by the image acquisition unit. The correction amounts includes a first correction amount for correcting an angle of the nozzle around the axis, a second correction amount for correcting a position of the antenna in a conveying direction of the antenna, and a third correction amount for correcting the position of the antenna in a width direction.

The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.

The image-capturing unit includes an imaging section; a holding section configured to hold a subject to be imaged by the imaging section; a light irradiation section configured to select light of one or more light sources out of multiple light sources having different wavelengths, and to irradiate the subject held in the holding section with the light; a storage section configured to store a correspondence among a color of the light emitted for irradiating the subject by the light irradiation section, a material of an irradiation surface irradiated with the light, and a resolution representing the number of pixels per unit length; and an image processing section configured to obtain the resolution from the correspondence, based on the color of the light emitted for irradiating the subject and the material of the irradiation surface of the subject, and to process a subject image by using the resolution.

A component mounting system includes a mounting machine configured to perform a mounting process of a component on a board by an operation of a unit for the mounting process, an inspector configured to perform an inspection process by using an image of the board after the mounting process and output abnormality information capable of specifying a defective board having an abnormality detected in the inspection process, a camera configured to image the operation of the unit in the mounting machine during the mounting process in a video to store image data in a memory, and a data output section configured to extract image data during the mounting process of the defective board from the memory based on the abnormality information and output the image data to an outside.

An optical pick and place machine that includes a self-calibrating optical controller for error feedback based optical placement of optical components using active alignment is described. The optical controller can include a loopback mode to generate a baseline value of light generated by a light source and measured by a photodetector within the optical controller. The optical controller can further include an active alignment mode in which the light is coupled from the pick and place machine to the optical device on which the component is placed. The optical coupling of the placed component can be evaluated against the baseline value to ensure that the optical coupling is within specification (e.g., within a prespecified range).

A mounting head includes a drive part that moves in a vertical direction to apply a load to an electronic component, a float part supported by the drive part in a vertically movable manner, and a linear motor that applies a vertical upward pressing force to the float part. The linear motor includes a stator fixed on the drive part and a moving member fixed on the float part. The drive part moves downward in the vertical direction to apply the load due to own weight of the float part to the electronic component to mount the electronic component onto the board. The linear motor is driven to control a magnitude of the load applied to the electronic component by applying the vertical upward pressing force to the float part.

A component mounter includes a camera configured to image the supply region, an image processing section configured to execute image processing on image data acquired by imaging of the camera to recognize an accommodation state of the component for each of the multiple cavities and acquire accommodation information in which the accommodation state of the component is associated with a unique address for each of the multiple cavities, and an operation control section configured to execute a collection operation of the component accommodated in the cavity based on the accommodation information.

A component mounter includes a component supply device equipped with a bulk feeder for supplying multiple components in a bulk state to a supply region for the components, a camera configured to image the supply region, an image processing section configured to execute image processing for distinguishing a region of at least a part of the component from a region of a background in image data acquired through imaging by the camera based on brightness, and a state recognition section configured to recognize a supply state of the component based on at least one of an area and a shape of a component region occupied by at least the part of the component in the image data on which the image processing has been executed.

A lead wire straightening device including a control device that disposes a lead wire of a lead component that is held by a holding section between a first claw section and a second claw section. The control device causes an opening/closing driving section of a straightening unit to clamp and straighten the lead wire by the first and second claw sections. After the lead wire is clamped, the control device causes a driving section to rotate at least one of the holding section and the straightening unit to thereby change positions of the first and second claw sections relative to the lead wire. Then, after changing the positions of the first and second claw sections relative to the lead wire, the control device causes the first and second claw sections to clamp the lead wire again to straighten the lead wire.

Component mounting machine includes head, a device for moving head, transfer unit, and a mounting controller. Circular plate is an example of a container in which paste is placed. The bottom face of circular plate and the upper surface of the side wall have a predetermined height relationship. Height sensor is disposed on the lower face of head. Height sensor measures the height of the upper surface of the side wall of circular plate, which is a measurement point. The mounting controller recognizes the height of the bottom face of circular plate or the height of the surface of coating film disposed on circular plate from the height of the top surface of the side wall of circular plate measured by height sensor.