A suction position adjustment device of a component mounter which includes a head having multiple pickup members and that executes simultaneous suction control for substantially simultaneously picking up multiple components with the multiple pickup members by moving the head to a target position that is determined to locate the multiple pickup members on the multiple components supplied from multiple feeders to a supply position. The suction position adjustment device includes an imaging device configured to image the supply position of the feeder from above, a display device, and a control device. The control device configured to control the imaging device so that an upper surface, at the supply position, in the multiple feeders of adjustment targets is captured and display, on the display device, captured multiple upper surface images and multiple pointers superimposed on the multiple upper surface images, when the target position is adjusted.

A substrate work machine for repeatedly performing substrate work, the substrate work machine including a data storing section configured to store component data used in the substrate work, the component data including shape data related to a shape of an electronic component to be mounted on a substrate, a reference value and a tolerance; a data determining section configured to determine whether a difference between measurement data acquired by measuring the electronic component during the substrate work and the reference value of the component data is within a range of the tolerance; a quality information acquiring section configured to acquire work quality information related to a performance condition of a second substrate work machine; and a data correcting section configured to correct at least one of the reference value and the tolerance in accordance with the work quality information.

The image data generation device includes a component information input section and an image data generation section. The component information input section is configured to input a mounting position and an outer shape of the electronic component for each of the multiple electronic components to be mounted in the mounting processing. The mounting position includes a position in a height direction orthogonal to a surface of the board. The image data generation section is configured to generate image data for displaying a state when each of the multiple electronic components to be mounted in the mounting processing is arranged at the mounting position of the electronic component based on the mounting position and the outer shape of the electronic component input by the component information input section.

A component mounter includes a state recognition section configured to recognize a supply state of a component in a supply area based on a feature amount including at least one of a shape and an angle of each of multiple feature portions in image data on which image processing has been executed. The state recognition section determines whether one or more candidate feature portions included in a search range belong to an identical component together with a reference feature portion based on one of feature amounts of the candidate feature portion and a positional relationship between the reference feature portion and the candidate feature portion.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of controllers being configured to control a respective one of the plurality of pipettes.

A component feeding system including: a stage configured to support components in a scattered state; a holding tool configured to pick up and hold the component scattered on the stage; an imaging device configured to image the components scattered on the stage; and a control device configured to acquire, based on image data of the imaging device, a pickup possible component quantity that is a quantity of components that can be picked up by the holding tool from among the components scattered on the stage.

An electronic component mounting apparatus includes: a transfer unit picking up an upper surface of a light emitting device package having a front surface on which a light emitting diode chip is disposed, and transferring the light emitting device package to a printed circuit board, a light source unit disposed on a transfer path of the light emitting device package, and irradiating measurement light onto the front surface of the light emitting device package, a camera capturing an image of the light emitting device package to which the measurement light is irradiated, and a control unit image-processing the image to identify excitation light, emitted when the measurement light is excited from the light emitting diode chip, in the image, and controlling the transfer unit to mount the light emitting device package on the printed circuit board when identifying the excitation light.

A method for mounting a component (100) on a workpiece (106), the method comprising obtaining information regarding a surface topography of at least one of a mounting surface (102) of the component and a local surface (108) of the workpiece onto which the component is to be mounted. The method further comprises forming a plurality of deposits (110) of a viscous medium on at least one of the mounting and local surfaces, wherein each of the plurality of deposits has a height (/½, /½, h3) based on the obtained information, and is formed by individually applying at least one droplet (234) of the viscous medium (232) using non-contact dispensing. The method further comprises placing the component on the substrate, such that the plurality of deposits of viscous medium forms a connection between the component and the workpiece.

A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.

There is provided technology which is a component mounting machine which mounts electronic components onto a circuit substrate and is capable of displaying a movable region of an inner portion of the component mounting machine within a same image. The component mounting machine is provided with a fixed camera which monitors the inner portion of the component mounting machine and a display section which is capable of displaying a captured image of the fixed camera. The fixed camera is capable of imaging a range from a pickup position at which the suction nozzle picks up the electronic component which is supplied from the component feeder to a mounting position at which the electronic component is mounted onto the circuit substrate within the same image.