A mounting device mounts components on a board, and performs processing of arranging discard components discarded based on a captured image on a discard loading section. A CPU of a management computer acquires an identification image in which it is possible to identify a discard component to be discarded and a captured image of the discard component, links the acquired identification image of the discard component and the captured image of the discard component, and creates a discard component arrangement image screen that includes an arrangement display area in which the identification images are arranged based on an order in which the discard components were arranged on discard loading section. The CPU of management computer then outputs the created discard component arrangement image screen.

An image processing device for processing an image of a tape having provided therein multiple cavities for receiving a component as a supply target includes a feature amount acquisition section configured to extract brightnesses of pixels within a predetermined range which can include a bottom surface of the cavity and a component inside the cavity using the image and acquire a value indicating scatter of the extracted brightnesses as a feature amount, and a determination section configured to determine on existence or non-existence of a component inside the cavity based on a determination threshold determined based on the feature amount for each of a case in which a component exists inside the cavity and a case in which no component exists inside the cavity and the feature amount acquired from the image.

Provided is an image processing method for easily viewing images obtained by imaging multiple components at a time, the method including image capturing processing of capturing each component holding state relating to multiple suction nozzles mounted on a mounting head as one image, image dividing processing of dividing a region relating to a predetermined component holding state for image data of the multiple component holding states obtained by the image capturing processing, direction conversion processing of converting a direction of the component holding state for divided image data divided by the image dividing processing, and display processing of displaying an image based on the divided image data subjected to the direction conversion processing.

A bulk feeder includes a feeder main body, a track member having a reception region in which multiple components discharged from a component case accommodating the components in a bulk state are received, a supply region to which the components are supplied, and a conveyance path of the components from the reception region to the supply region, a vibration device configured to apply vibration to the track member such that the components on the conveyance path are conveyed, and an alignment member configured to guide the multiple components conveyed by the vibration of the track member and align the components with respect to the feeder main body.

A component mounter includes a component supply device equipped with a bulk feeder for supplying multiple components in a bulk state to a supply region for the components, a camera configured to image the supply region, an image processing section configured to execute image processing for distinguishing a region of at least a part of the component from a region of a background in image data acquired through imaging by the camera based on brightness, and a state recognition section configured to recognize a supply state of the component based on at least one of an area and a shape of a component region occupied by at least the part of the component in the image data on which the image processing has been executed.

A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.

A component supply device, including a stage on which components are scattered; an imaging device configured to image components scattered on the stage; a storage device configured to store first identification information capable of identifying a first component which is a component scheduled to be supplied from the stage and second identification information capable of identifying a second component which is a component not scheduled to be supplied from the stage; and a determination device configured to determine whether the first component is present on the stage based on the first identification information and imaging data from the imaging device, and to determine whether the second component is present on the stage based on the second identification information and imaging data from the imaging device.

In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

A component mounting device includes a component supply device that supplies a component to a component supply position by using a component housing tape, a head unit provided with a suction nozzle that can be moved up and down, a first image capturing unit that captures the component supplied to the component supply position, and a component posture determination unit that determines the posture of the component supplied to the component supply position. Based on a captured image captured by the first image capturing unit, the component posture determination unit determines whether the component takes an abnormal posture protruding from a component housing part in a direction intersecting the vertical direction on a horizontal plane in the component housing tape.

In a material verification method, information of newly loaded materials in a production line is obtained. It is determined whether the information has been verified. If the information has not been verified, it is determined whether a tray supporting the newly loaded materials has been switched from use in producing a first product to use in producing a second product. If the tray supporting the newly loaded materials is not switched to use in producing the second product, the information of the newly loaded materials is presented to a user for material verification. A system for administering such method and a device applying the method are also disclosed.