A resin sheet is provided having low dielectric properties, and a circuit board material using such a sheet. The resin sheet includes a resin layer containing a cyclic polyolefin resin copolymer having a crystal melting peak temperature of less than 100° C., the resin sheet having a dielectric loss tangent at 12 GHz of less than 0.005.

It is an object to provide a formed film and a method for manufacturing a formed film. According to an embodiment, a method for manufacturing a formed film comprises providing a formable film having a conductive pattern on a first side of the formable film. The method may further comprise printing a deformation-preventing element onto the formable film and forming at least one section of the formable film at a forming temperature. A modulus of elasticity of the deformation-preventing element at the forming temperature may be greater than a modulus of elasticity of the formable film at the forming temperature. A method, a formed film, and an electronic device are provided.

A substrate according to an embodiment includes an insulating layer having a grain formed therein extending in a first direction; and a circuit pattern disposed on the insulating layer; wherein the insulating layer includes an upper surface and a plurality of outer side surfaces; wherein the plurality of outer side surfaces includes: a first outer side surface extending in the same first direction as the first direction having the grain formed in the insulating layer; and a second outer side surface extending in a second direction different from the first direction and excluding the first outer side surface, wherein the first outer side surface has a first surface roughness; and wherein the second outer side surface has a second surface roughness different from the first surface roughness.

An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.

Sheet comprising a flexible support and a coating at least partially covering at least one face of the support, the support being made of a support material exhibiting dielectric properties, the coating being made of a coating material different from the support material and exhibiting magneto-dielectric properties or dielectric properties.

The conductive composition of the present embodiment contains metal nanoparticles having an average particle diameter of 30 nm to 600 nm, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. Then, the specific resistance of the conductor formed by applying and calcining the conductive composition on the substrate is preferably 5.0×10.sup.−6 Ω.Math.cm or less, and the conductor does not peel from the substrate when a tape having an adhesive force of 3.9 N/10 mm to 39 N/10 mm is pressed against the conductor and peeled off.

A flexible wiring board that includes a flexible substrate; a flexible wiring over the flexible substrate; and a protective layer over the flexible substrate, where the protective layer includes: a first region that overlaps with the flexible wiring and a second region that does not overlap with the flexible wiring as viewed from a thickness direction of the flexible substrate, and a low flexibility part that is higher in flexibility ratio than the first region and is disposed along an extending direction of the flexible wiring in the second region.

A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.