A method for manufacturing a flex inlay is provided. The method includes providing a flexible printed circuit having opposed surfaces. The method includes attaching components to a surface of the flexible printed circuit. The method includes applying a coverlay over at least one surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the surface of the flexible printed circuit. The coverlay at least in part forms an essentially planar surface of the flex inlay.

An electronic device includes a communication circuit electrically connected with a circuit board. The circuit board includes a first portion comprising a first layered structure in which a wiring layer and a first insulating layer are alternately positioned, and a second portion comprising a second layered structure in which the wiring layer and the first insulating layer are alternately positioned and a second insulating layer. At least one antenna patch is positioned on or within the second insulating layer. A conductive line penetrates the second layered structure and the second insulating layer and electrically connects the at least one antenna patch and the communication circuit. The first insulating layer has a first loss tangent value, and the second insulating layer has a second loss tangent value smaller than the first loss tangent value.

A stretchable substrate according to an embodiment of the present invention comprises a first modulus region which has a first modulus, a second modulus region which is located in a plane direction with respect to the first modulus region and has a second modulus higher than the first modulus, and a third modulus region which is located between the first modulus region and the second modulus region and has an interface modulus which gradually changes between the first modulus and the second modulus, wherein the interface modulus of the third modulus region may be constant in the thickness direction thereof.

A semiconductor device, a circuit board structure and a manufacturing forming thereof are provided. A circuit board structure includes a core layer, a first build-up layer and a second build-up layer. The first build-up layer and the second build-up layer are disposed on opposite sides of the core layer. The circuit board structure has a plurality of stress releasing trenches extending into the first build-up layer and the second build-up layer.

A multilayer board includes a flexible substrate including insulating layers stacked and a pair of through-holes penetrating the insulating layers, and an interlayer connecting conductor in an opposing region in which the pair of through-holes opposes each other in a plan view of the insulating layers viewed from a stacking direction. A cross section of the flexible substrate taken in a lateral direction passing through the pair of through-holes and the interlayer connecting conductor and the stacking direction has a U or S shape. In the cross section, a curvature radius of an inner region located between the pair of through-holes is larger than a curvature radius of an outer region adjacent to the pair of through-holes on an outer side thereof.

A component carrier includes a layer stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, at least one opening in the layer stack, a first curable dielectric element arranged at least partially on the opening, and a second curable dielectric element arranged adjacent to the first curable dielectric element, so that there is an interface region in between. A part of the first curable dielectric element extends partially into the opening.

A circuit board structure includes a substrate, a third dielectric layer, a fourth dielectric layer, a first external circuit layer, a second external circuit layer, a conductive through hole electrically connected to the first and second external circuit layers, a first annular retaining wall surrounding the conductive through hole, and a second annular retaining wall surrounding the conductive through hole. The first annular retaining wall is electrically connected to the first external circuit layer and a first inner circuit layer. The second annular retaining wall is electrically connected to the second external circuit layer and a second inner circuit layer. A first ground circuit, the first annular retaining wall, and the first inner circuit layer define a first ground path surrounding a first signal circuit. A second ground circuit, the second annular retaining wall, and the second inner circuit layer define a second ground path surrounding a second signal circuit.

A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.

A circuit board includes a substrate, a first magnetic structure, a first dielectric layer and an inductive coil. The substrate has a top surface and a bottom surface. The first magnetic structure is disposed on the top surface of the substrate. The first dielectric layer covers the substrate and the first magnetic structure. The inductive coil includes a first interconnect, a second interconnect and a plurality of conductive pillars. The first interconnect is disposed on the first dielectric layer. The second interconnect is disposed on the bottom surface of the substrate. The conductive pillars connect the first interconnect and the second interconnect. The first interconnect, the second interconnect and the conductive pillars form a helical structure surrounding the first magnetic structure.

A microwave generator for a microwave device includes a single component carrier for control components and power components, which includes a continuous carrier material. Two power regions and one control region are provided on the component carrier. In the control region, electrically functional components are arranged on both flat sides of the component carrier, while in the power regions, electrically functional components with at least one power switch are arranged only on an upper flat side, heat sinks being arranged on the lower flat side. An RF substrate is provided in regions on the upper flat side of the power region.