The present application provides an asymmetric board, which includes the first master board, the second master board, and the insulating dielectric layer sandwiched between the first master board and the second master board, and the depth control grooves are disposed in the connection position between the units on the asymmetric board, and located on the surface of the second master board and extending a toward the side of the first master board, the depth control grooves provide space for the expansion of the second master board, reduce the stress of the units, and reduce the warping of the second master board. When the number of the depth control grooves in the first direction and/or the second direction is greater than 0, the depths of the depth control grooves increase by X from a center to an edge of the asymmetric board, and the X is greater than or equal to 0.

A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.

Provided is an electronic control unit capable of suppressing an increase in size of a board. An electronic control unit of the present invention includes a connector having a power supply terminal, a power supply board 12 (first board), and a control board 13 (second board). The power supply board includes an inner-layer copper foil 55 (inner-layer conductor), and a power conversion circuit that converts input power input via a power supply terminal into predetermined output power is mounted thereon. The control board 13 includes an inner-layer copper foil 55, and mounted with a control circuit is mounted thereon. In addition, a thickness of the inner-layer copper foil 55 of the power supply board 12 is thicker than a thickness of the inner-layer copper foil 55 of the control board 13.

A multilayer substrate includes a pair of first capacitor electrodes, a pair of second capacitor electrodes, and a dielectric substrate. Electrodes of the pair of first capacitor electrodes are disposed in dielectric substrate so as to face each other in a thickness direction of the dielectric substrate. Electrodes of the pair of second capacitor electrodes are disposed in the dielectric substrate so as to face each other in the thickness direction. A first element and a second element that are disposed in or on the dielectric substrate, and the pair of second capacitor electrodes, the pair of first capacitor electrodes, and a ground electrode that are disposed in the dielectric substrate are arranged in the stated order in the thickness direction. The pair of second capacitor electrodes at least partially overlaps the pair of first capacitor electrodes when viewed in plan in the thickness direction.

A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.

The present application provides an asymmetric board, which includes the first master board, the second master board, and the insulating dielectric layer sandwiched between the first master board and the second master board, and the depth control grooves are disposed in the connection position between the units on the asymmetric board, and located on the surface of the second master board and extending a toward the side of the first master board, the depth control grooves provide space for the expansion of the second master board, reduce the stress of the units, and reduce the warping of the second master board. When the number of the depth control grooves in the first direction and/or the second direction is greater than 0, the depths of the depth control grooves increase by X from a center to an edge of the asymmetric board, and the X is greater than or equal to 0.

Systems for reducing leakage at a pressure barrier in a gas meter, are provided including first and second gaskets; a flexible circuit having variable thicknesses, such that a thicker portion of the flexible circuit is provided between the first and second gaskets; and a mounting plate on the flexible circuit, the mounting plate compressing the flexible circuit between the first and second gaskets on a non-pressurized side of the pressure barrier of the gas meter. Related flexible circuits and gas meters are also provided.

An interconnect substrate includes a core layer including a resin layer mainly composed of a non-photosensitive thermosetting resin and a through interconnect extending through the resin layer, the core layer having no reinforcement member contained therein, a first interconnect structure laminated on a first side of the core layer and including first interconnect layers and first insulating layers mainly composed of a photosensitive resin, and a second interconnect structure laminated on a second side of the core layer and including second interconnect layers and a single second insulating layer mainly composed of a photosensitive resin, wherein the first interconnect layers are electrically connected to the second interconnect layers via the through interconnect, wherein the core layer has greater rigidity than the first interconnect structure and the second interconnect structure, and wherein a thickness of the second interconnect structure is greater than a thickness of each of the first insulating layer.