A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

A heat resistant electronic component is disclosed, comprising an electronic component covered by a layer of ceramic thermal insulation material containing lithium molybdate Li.sub.2MoO.sub.4. A process for manufacturing the heat resistant electronic component comprises obtaining ceramic thermal insulation material containing lithium molybdate Li.sub.2MoO.sub.4 in a mouldable form, optionally mixing the ceramic thermal insulation material with at least one additive, covering an electronic component with the material, shaping the material covering the electronic component into a desired form, and drying the desired form at a temperature of from 20° C. to 120° C.

A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

An opto-electric hybrid board includes an optical waveguide, and an electric circuit board disposed on a one-side surface in the thickness direction of the optical waveguide. The electric circuit board includes a first terminal on which an optical element portion is mounted and a second terminal on which a driver element portion is mounted. The electric circuit board includes a metal supporting layer that overlaps the first terminal and the second terminal when the electric circuit board is projected in the thickness direction. The metal supporting layer has an opening portion that is located between the first terminal and the second terminal when the metal supporting layer is projected in the thickness direction.

A display device is disclosed. The display device includes a display panel configured to display an image, and a printed circuit board electrically connected to the display panel and disposed at a back surface of the display panel. The printed circuit board includes an insulating layer, a first metal layer disposed at one surface of the insulating layer, pads including a first pad disposed on the first metal layer while being disposed inside a mounting area where an integrated circuit is mounted, and second pads disposed around the first pad, and a groove provided to extend from an inside of the mounting area to an outside of the mounting area.

A charger having a heat insulating structure is provided. The charger includes: a case having one side at which an opening is formed and the other side to which a terminal portion is coupled; a printed circuit board having a front surface and a rear surface on which electronic components are mounted, respectively, and inserted into the case through the opening of the case; a heat insulating member disposed inside the case and formed to cover the electronic components mounted on the rear surface of the printed circuit board to block heat generated from the electronic components of the printed circuit board from being transferred to an entire surface of the case; and a cover closing the opening of the case.

A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.

An electrical circuit board includes a first conductive layer and a second conductive layer. And an interlayer forming a thermal barrier is placed between the first conductive layer and the second conductive layer, wherein the thermal barrier reduces heat transfer between the first conductive layer and the second conductive layer.

To improve a substrate unit in which safety maintaining devices are mounted on a wiring substrate while suppressing manufacturing costs.

A substrate unit includes a wiring substrate, electronic components as safety maintaining devices arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film covering at least one of the plural metal components and the electronic components as the safety maintaining devices on the wiring substrate, in which the resin film has a thermal conductivity of at least 1.0 W/mk and a dielectric breakdown strength of at least 3.0 kV/mm.