An automated and/or motorized spatial frame including a control unit and a plurality of motorized struts is disclosed. The control unit being configured as a controller for exchanging data with an external computing system, exchanging data with the plurality of motorized struts, and delivering power to the motorized struts. Thus arranged, the control unit may be configured as a fully integrated power supply and controller for powering and controlling the motorized struts. In some embodiments, the control unit includes a plurality of PCB modules, each positioned within the spaces or pockets formed between adjacent tabs on a ring of the frame. The PCB modules being detachably coupled to the ring. In some embodiments, the PCB modules may be detachably coupled to the ring via interconnecting male and female connectors. Alternatively, the PCB modules may be detachably coupled to the ring via a plurality of brackets.

The embodiment of the disclosure provides a composite layer circuit element and a manufacturing method thereof. The manufacturing method of the composite layer circuit element includes the following. A carrier is provided. A first dielectric layer is formed on the carrier, and the first dielectric layer is patterned. The carrier on which the first dielectric layer is formed is disposed on a first curved-surface mold, and the first dielectric layer is cured. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer is patterned. The carrier on which the first dielectric layer and the second dielectric layer are formed is disposed on a second curved-surface mold, and the second dielectric layer is cured. A thickness of a projection of the first curved-surface mold is smaller than a thickness of a projection of the second curved-surface mold.

Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

A constant-current controller that supplies a constant-current to a solenoid driver for use with an electromechanical device. The controller comprises a PCB containing a constant-current control circuit. The circuit comprises a GaNFET primary switch and a secondary switch. The PCB is integrated with and made a part of the solenoid driver. A standard electromechanical device may be converted to a constant-current controlled electromechanical device by exchanging the solenoid driver.

An LED lamp having a metal PCB bent polyhedrally and a method for manufacturing the LED lamp is provided, where a base constituting the metal PCB has a rectangular or geometric shape and is configured to have a plurality of base stepped grooves formed spaced apart from each other on the underside thereof in such a manner as to be bent upward or downward from the base to form reflection surfaces continuously, so that at the time when both ends of the base come into contact with the plane, the base has a geometric shape in which the base is located in space through the reflection surfaces continuously arranged.

A constant-current control circuit comprising a switching circuit including a source voltage, and primary and secondary switches is provided. The primary GaNFET switch is connected with a solenoid assembly coil. The secondary switch is connected with the coil which has an inductance. From t.sub.0 to t.sub.on, the primary GaNFET switch is closed and the secondary switch is open, the source voltage is applied across the coil, and a counter EMF decays until the voltage across the coil equals the source voltage at t.sub.on, thereby allowing current to flow through the coil. From t.sub.on to T, the primary GaNFET switch is open and the secondary switch is closed, and a positive EMF equal to the source voltage is applied across the coil until the positive EMF decays to zero at T, such that the current continues to flow through the coil without the source voltage being applied across the coil.

An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.

An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.

A power tool including an electric motor is provided. The tool includes a substantially disc-shaped printed circuit board (PCB), power switches mounted on the PCB; magnetic sensors mounted on the PCB facing the motor; a heat sink in thermal communication with the power switches disposed between the PCB and the electric motor; and a molded casing structurally securing the heat sink relative to the PCB. The molded casing includes a center opening, at least one first opening provided at a first radial distance from the center opening arranged to receive the magnetic sensors therein, and at least one second opening provided at a second radial distance from the center opening arranged to securely receive the heat sink therein.

Provided is a self-adhesive sheet including a 4-methyl-1-pentene-based polymer. In the self-adhesive sheet, it is preferable that at least one or more temperatures showing a local maximum value of a loss tangent (tan δ) , which is obtained by dynamic viscoelasticity measurement under conditions of a temperature rising rate of 4° C./min, a frequency of 1.59 Hz, and a strain amount of 0.1%, are present in a range of 10° C. or higher and 100° C. or lower, the local maximum value of the loss tangent is 0.5 or more and 3.5 or less, an arithmetic average roughness Ra on one surface of the self-adhesive sheet is in a range of 0.01 to 10 .Math.m, and a ten-point average roughness Rz is in a range of 0.1 to 50 .Math.m.