A wiring board includes: an insulating layer; and a connection terminal formed on the insulating layer. The connection terminal includes a first metal layer laminated on the insulating layer, a second metal layer laminated on the first metal layer, a metal pad laminated on the second metal layer, and a surface treatment layer that covers an upper surface and a side surface of the pad and that is in contact with the upper surface of the insulating layer. An end portion of the second metal layer is in contact with the surface treatment layer, and an end portion of the first metal layer is positioned closer to a center side of the pad than the end portion of the second metal layer is to form a gap between the end portion of the first metal layer and the surface treatment layer.

The coil substrate may include a substrate; a first conductor layer including a plurality of first and second segments periodically disposed on a top and a bottom of the substrate; a second conductor layer including a plurality of first and second segments periodically overlapping the first conductor layer on the top and the bottom of the substrate; a first connection line that connects the first and second segments of the first conductor layer; and a second connection line that connects the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.

A printed wiring board includes resin insulating layers, and conductor layers including a conductor layer such that the conductor layer includes a conductor circuit and that the conductor circuit has a surface index X/Y in a range of 1.00 to 2.20 where X is a length of an outer circumference of cross section of the conductor circuit, and Y is a length of an outer circumference of a reference quadrangle in the cross section of the conductor circuit. The reference quadrangle has a first reference line drawn with reference to bottom of deepest recess on first side, a second reference line is drawn with reference to bottom of deepest recess on second side, a third reference line is drawn with reference to bottom of deepest recess on third side, and a fourth reference line is drawn with reference to bottom of deepest recess on fourth side of the outer circumference.

A circuit board includes a board body, a signal conductor, a power supply conductor, and a first reference conductor. The signal conductor is in the board body and a high frequency signal is transmitted through the signal conductor. The power supply conductor is in the board body and is connected to a power supply potential. The power supply conductor extends along at least a portion of the signal conductor. The first reference conductor is in the board body and is insulated from the signal conductor and the power supply conductor.

A connecting member for electrically connecting a circuit board and a component in an electronic device is provided. The connecting member includes at least one bending part configured to comprise elasticity, a pad part connected to the bending part and configured to be attached to one surface of the circuit board, and a fixing part extending from the pad part and configured to fix the connecting member to the circuit board.

A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

A printed circuit board according to an embodiment includes: an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 μm to 0.31 μm.

To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable.

A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.

A semiconductor device comprises a semiconductor substrate, one or more circuits disposed on the semiconductor substrate, and a modification of any one of hardware, software or firmware of the electronic device that generates emission of electromagnetic energy from the semiconductor device with desired characteristic(s), without changing a designed interface functionality of the semiconductor device. Method are also provided for modifying the semiconductor device and identifying modified semiconductor device.

A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.