Provided are a circuit board component and a terminal. The circuit board component includes: a circuit board and a wire disposed on the circuit board, where the wire includes a first portion and a second portion, a line width of the first portion is greater than or equal to a line width threshold, and a line width of the second portion is less than the line width threshold.

A printed circuit board for an information handling system includes a trace, a routing component, and one or more intermediate components. The trace has a first impedance, and the routing component has a second impedance. The intermediate components have respective intermediate impedances. Each of the intermediate impedances has a corresponding value in a range between a value of the first impedance and a value of the second impedance. The one or more intermediate impedances reduce an impedance discontinuity between the trace and the routing component.

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

An illuminating circuit structure includes a film sheet, an illuminant, a printed baseline layer, and a printed pad layer. The printed baseline layer includes a first baseline segment and a second baseline segment printed on the film sheet, while the printed pad layer includes a first bar pad and a second bar pad. For a first baseline head of the first baseline layer and a first pad head of the first bar pad, one of which extends along a first direction and the other of which extends along a second direction not parallel to the first direction. Therefore, the first baseline segment and the first bar pad achieve electrical connection despite of an existed print shifting. Similarly, a second baseline head of the second baseline layer and a second pad head of the second bar pad also can achieve electrical connection despite of an existed print shifting.

A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.

A flexible printed circuit board including a terminal includes a flexible printed circuit board that includes an electrically conductive line and the terminal soldered to the flexible printed circuit board. The flexible printed circuit board includes a land and a soldering restricting section. The land is electrically connected to the electrically conductive line and has a metal surface and is soldered to the terminal. The soldering restricting section has a non-metal surface and is not soldered to the terminal. The terminal includes an overlapping section and a protrusion section. The overlapping section overlaps the land and is soldered to the land and includes a removed section that is formed in such a manner that a portion is partially removed in a predefined area. The protruding section is continuous from the overlapping section and protrudes to an area that does not overlap the flexible printed circuit board.

A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards

An electronic device (100) comprises a stretchable substrate (30) with a flap (30f) formed by a cut (40) in the substrate (30). The flap (30f) is disconnected by the cut (40) from a surrounding main section (30m) of the substrate (30) except on one side. The flap (30f) is exclusively connected to the main section (30m) via a connected section (30c) of the substrate (30) between two ends (40a, 40b) of the cut (40). An electronic component (10) is disposed on the flap (30f) with electrical contacts (11,12) connected to conductive tracks (21,22) disposed on the substrate (30). The conductive tracks (21,22) extend between the component (10) disposed on the flap (30f), and other parts (10r) of the electronic device (100) outside the flap (30f) via the connected section (30c). The flap (30f) with the component (10) is disposed in a pocket formed by surrounding lamination layers (31,32).

A circuit board according to an embodiment includes an insulating layer; and a via portion disposed in a via hole formed in the insulating layer; wherein the via portion includes: a first pad disposed on a lower surface of the insulating layer; a second pad disposed on an upper surface of the insulating layer; a third pad disposed in the via hole and disposed on the first pad; and a connection portion disposed in the via hole and disposed between the second pad and the third pad.

A transmission line includes a substrate including insulator layers, a mounting electrode on a front layer of the substrate, a signal conductor, a first ground conductor, a first connecting electrode that electrically connects the mounting electrode and the signal conductor and is between the signal conductor and the first ground conductor in a laminating direction, a first inter-layer connecting conductor that is electrically connected between the mounting electrode and the first connecting electrode and is bonded to the first connecting electrode, and a second inter-layer connecting conductor that is electrically connected between the signal conductor and the first connecting electrode, is bonded to the first connecting electrode, and does not overlap with the first inter-layer connecting conductor when viewed in the laminating direction. The first ground conductor does not overlap with at least a portion of the first connecting electrode when viewed in the laminating direction.