A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

A circuit board comprising a circuit board ply, on which are provided a high-frequency component emitting electromagnetic interference waves during operation and at least one other component, especially another high-frequency component, wherein during operation an as low as possible degrading of the other component by interference waves is achieved. There is provided between the high-frequency component and the other component at least one dielectric barrier, which blocks propagation of high-frequency electromagnetic waves between the high-frequency component and the other component.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer.

A circuit board (3) is provided with a first rigid part (11) having a power system electronic component mounted thereon, a second rigid part (12) having a control system electronic component mounted thereon, and a thin flexible part (13) connecting the first and second rigid parts to each other. The flexible part (13) is provided with a plurality of conductive wires (27) conducted with the electronic components of the first and second rigid parts (11, 12). A non-conductive metal pattern (33) that is a dummy pattern is formed along an outer edge (13a) of the flexible part (13). By the non-conductive metal pattern (33), the disconnection of the conductive wires (27) due to cracking is suppressed.

The invention relates to a carrier arrangement (100; 500; 600; 700; 800; 900; 1000), and a method for producing a carrier arrangement. The method comprises: producing a layer (130; 530; 630; 730; 830; 930; 1030) on a surface (120; 520; 620; 720; 820; 920; 1020) of a carrier (110; 510; 610; 710; 810; 910; 1010), the layer comprising a first region (131; 531; 631; 731; 831; 931; 1031) and a second region (132; 532; 632; 732; 832; 932; 1032) connected to the first region, the first region covering a first surface region (121; 521; 621; 721; 821; 921; 1021) of the carrier and the second region covering a second surface region (122; 722; 922) of the carrier, detaching the second region of the layer from the carrier, the first region of the layer remaining on the first surface region of the carrier and not being separated from the second region, the layer being flexible in the detached second region.

A circuit board (3) is provided with a first rigid part (11) having a power system electronic component mounted thereon, a second rigid part (12) having a control system electronic component mounted thereon, and a thin flexible part (13) connecting the first and second rigid parts to each other. The flexible part (13) is provided with a plurality of conductive wires (27) conducted with the electronic components of the first and second rigid parts (11, 12). A non-conductive metal pattern (33) that is a dummy pattern is formed along an outer edge (13a) of the flexible part (13). By the non-conductive metal pattern (33), the disconnection of the conductive wires (27) due to cracking is suppressed.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

Disclosed are a method and a structure for layout and routing of a PCB. The method includes: arranging signal lines, a power plane and a ground plane of the PCB in combination, where a portion of a reference plane for the signal lines is configured as a ground plane for providing a reference plane and return paths for the signal lines, to save routing spates. Layout of regions for the power supply, the ground and signal lines is appropriately designed, thereby improving the design density of a board, reducing the number of layers of the PCB, and saving cost.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.