A test board configured to test a device under test includes: a connection region including first and second connection terminals for contacting the device under test; and a first surface mount device located adjacent to the connection region, wherein the first connection terminal is configured to be electrically connected to a first voltage regulator of the device under test, wherein the second connection terminal is configured to be electrically connected to a second voltage regulator of the device under test, and wherein the first surface mount device is configured to be electrically connected to each of the first and second connection terminals.

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

In one embodiment, an apparatus generally comprises a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from the first side to the second side, the first side configured for receiving an application specific integrated circuit (ASIC), and a power delivery board mounted on the second side of the printed circuit board and comprising a power plane interconnected with power vias in the power delivery board to electrically couple voltage regulator modules and the ASIC. The voltage regulator modules are mounted on the second side of the printed circuit board.

Technologies directed to coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes an RF shielding structure coupled to a ground connection on the second layer and located in the first insulation layer. The RF shielding structure is configured to operate as a RF short circuit between the ground connection and a third conductive trace on the first layer at RF frequencies.

A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include a plurality of layers that include a plurality of signal layers, a plurality of ground plane layers, a plurality of inner signal layers, and a single core substrate layer. Each layer in the plurality of layers may be separated from every other layer in the plurality of layers by at least one prepreg substrate layer.

Embodiments of the present disclosure relate to the field of communication device technology, which provide a circuit board including a first signal line and a second signal line that are disposed adjacent to each other, a ground plane, and a conductive layer connected to the ground plane. The conductive layer is disposed between the first signal line and the second signal line. Embodiments of the present disclosure further provide a communication device.

A wiring board according to the present disclosure includes a core insulating layer, a first laminated body located on an upper surface of the core insulating layer, and a second laminated body located on a lower surface of the core insulating layer. Each of the first laminated body and the second laminated body has a structure in which at least four electrical conductor layers and at least three build-up insulating layers are alternately located. The electrical conductor layers include two types, that are a first electrical conductor layer and a second electrical conductor layer. In the electrical conductor layers in the first laminated body, at least a first outermost layer and a first innermost layer are the first electrical conductor layers, and a first intermediate layer located farther from the core insulating layer than the first innermost layer includes at least two or more of the second electrical conductor layers.

A robust, reliable, and efficient UHD HDR IP client device, such as a set top box, receives content, for example, from a cable service provider so that the content can be displayed to a compatible display device with improved visual effect. The UHD HDR IP client device PCB design layout comprises a PCB. The PCB includes six layers that maximize the efficiency of the UHD HDR IP client device that includes. The six layers with a design layout that maximizes efficiency and routing provides an improved quality of experience for a user for viewing on a display received 4K or higher content.

A method and apparatus for arranging fuses in a printed circuit board includes a power input configured to connect to a power source, at least one electrical component connected to the power input, a first output connected to the at least one electrical component and configured to connect to a load, and a fuse disposed between the at least one electrical component and the first output, and having a first trip rating.

A battery module includes a lower housing and a plurality of battery cells. The plurality of battery cells are electrically coupled together to produce a voltage. The module also includes an assembly disposed over the battery cells and coupled to the lower housing. The assembly may include a lid and a plurality of bus bar interconnects mounted on the lid. The module also includes a printed circuit board (PCB) assembly disposed on and coupled to the assembly. The PCB assembly may include a PCB. The module also includes a cover disposed over and coupled to the lower housing to hermetically seal the battery module. Also disclosed is a method of manufacturing the battery module.