The device may include a core. The device may include built-up layers arranged over the core. The device may also include a ground path disposed in a first built-up layer of the built-up layers. The device may also include a power path disposed in a second built-up layer of the built-up layers. The device may also include a multi-terminal capacitor on a top layer of the built-up layers. The multi-terminal capacitor may be coupled to the ground path and the power path through respective vias passing through the built-up layers. The respective vias may be arranged to alternate such that respective vias coupled to the power path neighbor a respective via coupled to the ground path.

An electronic device according to various embodiments may include a housing, an antenna structure positioned in the housing, and a wireless communication circuit. The antenna structure may include a first conductive layer including a first opening, a second conductive layer positioned in parallel with the first conductive layer, and including a second opening which overlaps at least in part with the first opening when the first conductive layer is seen from above, a third conductive layer positioned in parallel with the first conductive layer and interposed between the first conductive layer and the second conductive layer, a first insulating layer interposed between the first conductive layer and the third conductive layer, a second insulating layer interposed between the second conductive layer and the third conductive layer, a first conductive plate electrically separated from the first conductive layer and disposed within the first opening, a second conductive plate electrically separated from the second conductive layer and disposed within the second opening, a first conductive via electrically coupled between the first conductive plate and the third conductive layer through the first insulating layer, and a second conductive via electrically coupled between the second conductive plate and the third conductive layer through the second insulating layer. The wireless communication circuit may be configured to transmit or receive a signal having a frequency between 3 Giga Hertz (GHz) and 100 GHz and is electrically coupled to the antenna structure. Various embodiments may be possible.

A printed circuit board and a display device are provided. A second wiring layer of the PCB includes a trace group, a system ground and an output pin group that includes power supply pins and a reference ground pin. One end of the power trace of the trace group is connected to one power supply pin, and another end of the power trace extends toward the system ground line. The insulating layer has a via hole corresponding to an overlapping portion of the power trace and the positive power supply signal line. The reference ground trace is disposed between the two power traces. The reference ground trace is between the reference ground pin and the system ground line. Voltage on the reference ground pin is stable to provide a stable power supply voltage. The ripple of the power supply voltage is reduced. The electromagnetic interference resistance is strong.

A printed circuit board (PCB) structure is provided for a solid state drive. In an embodiment, a solid state drive includes top and bottom layers, multiple intermediate layers and a ground cage. Each of top and bottom layers includes a plurality of components for operation of the solid state drive. The multiple intermediate layers enable electrical signals to pass between components on the top and bottom layers, one of the multiple intermediate layers including a power plane having a high voltage relative to each of the other planes. The ground cage shields signal traces on the same layer as the power plane and planes in adjacent layers from noise generated by the power plane.

Monolithic power stage (Pstage) packages and methods for using same are provided that may be implemented to provide lower thermal resistance/enhanced thermal performance, reduced noise, and/or smaller package footprint than conventional monolithic Pstage packages. The conductive pads of the disclosed Pstage packages may be provided with a larger surface area for contacting respective conductive layers of a mated PCB to provide a more effective and increased heat transfer away from a monolithic Pstage package. In one example, the increased heat transfer away from the monolithic Pstage package results in lower monolithic Pstage package operating temperature and increased power output. In another example, a monolithic Pstage package may be provided with an adaptive application-oriented interface and a multi-function pin that allows the same monolithic Pstage package to automatically detect and select between a relatively higher power information handling system application, and a relatively lower power information handling system VR application.

An embodiment provides a circuit board including: a terminal part including a plurality of first terminals, a body part spaced apart from the terminal part and including a plurality of second terminals, and a wire part between the terminal part and the body part, wherein the wire part includes a power wire and a ground wire connecting the plurality of first terminals and the plurality of second terminals, and the ground wire is disposed more outward than the power wire, within the wire part.

Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.

The present disclosure relates to light source driving systems, for example laser driving systems. The systems are configured to include a very low inductance current loop for driving an initial part of the current drive signal to turn on the light source. By implementing the system to have a very low inductance current loop, a very fast turn on time may be achieved for the light source, which can be particularly useful for Time of Flight systems that require a very quick turn-on response from the light source.

A circuit board includes a base substrate, and a connection structure disposed on the base substrate, and connected to the base substrate by an accessing part. The connection structure includes a first connection electrode, a second connection electrode disposed in a same layer as the first connection electrode, a third connection electrode connected to the first connection electrode on the first connection electrode, and a fourth connection electrode connected to the second connection electrode on the second connection electrode, and disposed in a same layer as the third connection electrode.

A printed circuit board and a display device are provided. A second wiring layer of the PCB includes a trace group, a system ground and an output pin group that includes power supply pins and a reference ground pin. One end of the power trace of the trace group is connected to one power supply pin, and another end of the power trace extends toward the system ground line. The insulating layer has a via hole corresponding to an overlapping portion of the power trace and the positive power supply signal line. The reference ground trace is disposed between the two power traces. The reference ground trace is between the reference ground pin and the system ground line. Voltage on the reference ground pin is stable to provide a stable power supply voltage. The ripple of the power supply voltage is reduced. The electromagnetic interference resistance is strong.