The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.

A board-level pad pattern includes a printed circuit board (PCB) substrate; an exposed pad region disposed within a surface mount region of the base substrate; and multiple staggered ball pads disposed within the surface mount region arranged in a ring shape around the exposed pad region. The staggered ball pads includes first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch. Multiple square-shaped ball pads are arranged in a third row between the exposed pad region and the staggered ball pads.

A display device includes a display substrate, a first connection wiring, and a signal wiring. The display substrate includes a display area and a pad area disposed outside the display area. The first connection wiring is disposed on the pad area of the display substrate. The signal wiring is disposed on the first connection wiring of the pad area of the display substrate. The signal wiring is electrically connected to the first connection wiring through a first contact hole. The signal wiring includes at least one first opening at least partially surrounded by the signal wiring in a plan view. The first opening is disposed closer to the display area than the first contact hole.

An illuminating circuit structure includes a film sheet, an illuminant, a printed baseline layer, and a printed pad layer. The printed baseline layer includes a first baseline segment and a second baseline segment printed on the film sheet, while the printed pad layer includes a first bar pad and a second bar pad. For a first baseline head of the first baseline layer and a first pad head of the first bar pad, one of which extends along a first direction and the other of which extends along a second direction not parallel to the first direction. Therefore, the first baseline segment and the first bar pad achieve electrical connection despite of an existed print shifting. Similarly, a second baseline head of the second baseline layer and a second pad head of the second bar pad also can achieve electrical connection despite of an existed print shifting.

An electronic component mounted body includes a substrate, a connection section provided on the substrate, an electronic component having a terminal connected to the connection section, and a solder that fixes the electronic component to the connection section. The connection section has a first region in which the terminal is fixed through the solder, and a second region lower in wettability than the first region, and the second region has an extension region extended to a peripheral edge of the connection section, and a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge.

A printed circuit structure includes a printed conductive pattern and a printed conductive adhesive pattern. The printed conductive pattern includes a first wire and a second wire. One of a first main contact portion of the first wire and a first main contact portion of a first adhesive of the printed conductive adhesive pattern extends in a first direction, while another thereof extends in a second direction perpendicular to the first direction. With different lengths in the first direction, manufacturing errors between the first wire and the first adhesive in the first direction can be contained without affecting the connection in between. Similarly, a second main contact portion of the second wire and a second main contact portion of a second adhesive of the printed conductive adhesive pattern can also adopt the same design in the first direction to ensure the electric connection.

An electronic device includes a multilevel package substrate with first and second levels extending in planes of first and second directions and spaced apart from one another along a third direction, the first level having a first side with landing areas spaced apart from one another along the first direction. The multilevel package substrate includes a conductive structure having first and second ends and conductive portions in the first and second levels that provide a conductive path along the first direction from the landing areas toward the second end, where the conductive structure includes indents that extend into the conductive portions in the first level, the indents spaced apart from one another along the first direction and positioned along the first direction between respective pairs of the landing areas.

A light device may include a printed circuit board having at least one conductive section. An LED may be electrically connected and fixed on a conductive section of the printed circuit board by means of a soldered connection. The printed circuit board may also include a coating-type insulating layer and/or the conductive section has an edge. The fixing region of the LED is connected to a discharge space by means of an outlet, so that during the production process, melted solder can flow off in a defined manner. The arrangement and/or embodiment of the outlet is such that in a preferred direction of movement of the LED is developed in order to position same in a defined manner.

A power supply module includes a main body, a first solder pad, and a plurality of metal connection pillars. The main body has a first surface and a second surface. The main body includes a package body, a package base layer, and a power chip. The package base layer, the power chip, and the first solder pad are all disposed in the package body. The power chip is connected to the package base layer. An end of the power chip away from the package base layer is connected to the first solder pad. Each metal connection pillar has a first end connected to the first solder pad and a second end extending through the main body to an outer side of the first surface of the main body.

The vehicle lighting device according to an embodiment includes a socket; a substrate provided on one end side of the socket and having a wiring pattern that includes a mounting pad and a connection pad connected to the mounting pad; a light emitting element being chip-shaped and bonded to the mounting pad using a bonding material; a wire wiring connected to an electrode of the light emitting element and the connection pad; a sealing part covering the light emitting element and the wire wiring; and a suppression part suppressing a component of the bonding material protruding from the light emitting element from reaching a position where the wire wiring is connected to the connection pad.