A circuit board for a light-emitting diode assembly includes a substrate layer, a dimming zone column disposed on one surface of the substrate layer, the dimming zone column including dimming zones, each of the dimming zones including a predetermined number of LED landing pads. The dimming zones includes a predetermined number of first dimming zones and a predetermined number of second dimming zones, a first common wiring commonly connected to the first dimming zones and disposed at a first lateral side in a row direction of the dimming zone column, a second common wiring connected to the second dimming zones and disposed at a second lateral side in the row direction opposite to the first lateral side of the dimming zone column, and an individual wiring connected to each of the dimming zones.

A circuit board for a light-emitting diode assembly according to an embodiment includes a substrate layer, dimming zones formed on one surface of the substrate layer, each of the dimming zones comprising a predetermined number of LED landing pads, and a wiring bundle disposed between the dimming zones neighboring in a row direction to extend in a column direction, the wiring bundle including wirings connected to the LED landing pads at the same level.

A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).

Described are solder stop features for electronic devices. An electronic device may include an electrically insulative substrate, a metallization on the electrically insulative substrate, a metal structure attached to a first main surface of the metallization via a solder joint, and a concavity formed in a sidewall of the metallization. The concavity is adjacent at least part of the solder joint and forms a solder stop. A first section of the metal structure is spaced apart from both the metallization and solder joint in a vertical direction that is perpendicular to the first main surface of the metallization. A linear dimension of the concavity in a horizontal direction that is coplanar with the metallization is at least twice the distance by which the first section of the metal structure is spaced apart from the first main surface of the metallization in the vertical direction. Additional solder stop embodiments are described.

A skin care device formed to cover the left side and right side of a human head and applying a micro current to a mask, includes: a wearing portion extending from the left side of the head through the back side to the right side; and an applying portion formed at each of two ends of the wearing portion and applying the micro current to the mask, wherein the applying portion includes: a conductive portion in contact with the mask; a cover portion to which the conductive portion is coupled and which includes a printed circuit board (PCB) generating the current; and a connecting portion electrically connecting the PCB and the conductive portion to each other, the connecting portion being formed of a conductive spring in elastic contact with the conductive portion.

An implantable electronic device includes a flexible circuit board, one or more circuit components attached to the flexible circuit board and configured to convert electrical energy into electrical pulses, and one or more electrodes attached to the flexible circuit board without cables connecting the electrodes to each other or to the flexible circuit board, the one or more electrodes configured to apply the electrical pulses to a tissue adjacent the implantable electronic device.

A wiring board including a component mounting portion with an increased strength is provided. In addition, an electronic device and an electronic module with high reliabilities are provided. The wiring board includes a base having a first face and a conductor positioned on the first face. The conductor has a region in which a plurality of first protrusions are positioned on a surface of the conductor, the plurality of first protrusions protruding in a same oblique direction that is oblique to a direction normal to the first face. The electronic device and the electronic module include the above-described wiring board and an electronic component mounted on the wiring board.

An optical integration device includes a first circuit layer comprising a first surface adjacent a first diffractive layer, the first diffractive layer arranged on a side of the first circuit layer along a first direction, and a first connecting pad electrically connected with the first circuit layer through a first conductive member. The optical integration device includes a side surface extending along the first direction. The side surface defines a first concavity extending through the first diffractive layer along the first direction. The first connecting pad includes a first mounting member connected with the side surface, and a first convex member extending from the first mounting member and received in the first concavity. The first conductive member includes a first conductive part arranged between the side surface and the first mounting member, and a second conductive part arranged between the first surface and the first convex member.

A printed circuit board has a solder joint inspection system including a substrate surface having at least one solder pad thereon, at least one conductor wire having an end attached to the at least one solder pad, and a first inspection feature. A first inspection feature is marked on the substrate surface adjacent to the at least one solder pad to define a conductor end zone on the at least one solder pad. The end of the conductor wire is in the conductor end zone when properly attached. The at least one solder pad may define a second inspection feature to mark an extent to which the at least one solder pad is covered by a flow of solder when the wire is properly attached.

A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: conductor layers and protective layers to form a multiple-layered structure of wiring patterns; a band-shaped main strip to be located to extend in a stacking direction of cells; and a band-shaped branch strip branched from the main strip. The branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a connection portion disposed closer to an end of the branch strip than the bent portion and connected to the corresponding busbar. The bent portion has a thin-layer portion having a shape formed by removing, from the flexible circuit board, a part of the protective layers corresponding to a part of the conductor layers without being used as the wiring pattern in the branch strip.