An electrical connector and a manufacturing method for the same. The electrical connector comprises a housing member and a plugging module. One end of the housing member is provided with a mating interface. An accommodating space communicating with the mating interface is provided in the housing member. The plugging module comprises a first circuit board, a plurality of electrical conductors and a plurality of first soldering pads. The first circuit board is disposed in the accommodating space. The first circuit board comprises a first surface and a second surface opposite to the first surface. The plurality of electrical conductors are disposed on the first surface and/or the second surface and is close to the mating interface. The plurality of first soldering pads are disposed on the second surface and are electrically connected with the plurality of electrical conductors.

A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.

A circuit board for a light-emitting diode assembly includes a substrate layer, a dimming zone column disposed on one surface of the substrate layer, the dimming zone column including dimming zones, each of the dimming zones including a predetermined number of LED landing pads. The dimming zones includes a predetermined number of first dimming zones and a predetermined number of second dimming zones, a first common wiring commonly connected to the first dimming zones and disposed at a first lateral side in a row direction of the dimming zone column, a second common wiring connected to the second dimming zones and disposed at a second lateral side in the row direction opposite to the first lateral side of the dimming zone column, and an individual wiring connected to each of the dimming zones.

An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.

The present disclosure provides a chip packaging structure including at least one chip packaging unit. The chip packaging unit includes a flexible substrate and a rigid substrate. The flexible substrate includes a first flexible substrate body, and a plurality of input pads and a plurality of output pads arranged on the first flexible substrate body, wherein the input pads and the output pads are connected in one-to-one correspondence. The rigid substrate includes a rigid substrate body and a chip arranged on the rigid substrate body, wherein the rigid substrate is bonded to a drive printed circuit board of a display device. Two opposite sides of the flexible substrate are respectively bonded to the rigid substrate and a display panel of the display device. The plurality of input pads are electrically connected to the chip, and the plurality of output pads are configured to transmit signals to the display panel.

A device is described that includes a carrier that has a plurality of light-emitting diode (LED) mounting areas. Each of the LED mounting areas includes a pair of contact pads, which are electrically coupled to the LED mounting area in a first subset of the plurality of LED mounting areas or electrically connected in series with a shunting element in the respective LED mounting area in a second subset of the plurality of LED mounting areas. In some embodiments, LEDs may be placed in the first subset of the plurality of LED mounting areas.

An LED board includes a flexible printed circuit and multiple LED-mounted parts arrayed on the circuit board at regular intervals in a constant direction. The LED-mounted parts each include multiple LEDs. The circuit board includes LED portions including the LED-mounted parts and non-LED portions including no LED-mounted parts that are arrayed alternately. The LED-mounted parts each have, in an array direction in which the LED-mounted parts are arrayed, a dimension equal to an interval between adjacent LED-mounted parts of the arrayed LED-mounted parts. A surface emitter includes multiple LED boards fitted together, with LED-mounted parts on each LED board overlapping non-LED portions of an adjacent LED board of the LED boards. The LED board and the surface emitter with the above structures easily upsize a video display device.

A quantum phased array comprising one or more arrays of emitter elements each emitting one or more particles having one or more quantum wavefunctions; one or more a phase shifting elements coupled to the emitter elements, each of the phase shifting elements comprising a source of a vector potential applying one or more phase shifts to the one or more quantum wavefunctions; and a control circuit coupled to the one or more phase shifting elements, the control circuit configuring the one or more vector potentials to control an interference of the quantum wavefunctions forming a distribution of the one or more particles at a target, and wherein the distribution is described by a wavefunction interference pattern resulting from the interference controlled by the vector potentials.

An electronic module includes a first wiring board, a second wiring board, and an intermediate connection member. The intermediate connection member includes an insulator, a plurality of first wirings supported by the insulator and arranged at intervals in a second direction intersecting a first direction, a plurality of second wirings supported by the insulator and arranged at intervals in the second direction, and a metal layer supported by the insulator and interposed between the plurality of first wirings and the plurality of second wirings so as to oppose the plurality of first wirings and the plurality of second wirings in a third direction intersecting the first direction and the second direction. A part of the metal layer sandwiched in the insulator is bonded to one of the first wiring board or the second wiring board by a conductive first bonding member.

An electrical connector for connecting to an array of surface contacts includes a connector body and a plurality of cable terminators. The connector body defines an interior volume and includes an external surface defining a plurality of cable openings each configured to receive a respective multi-conductor cable therethrough and a plurality of passageways. The plurality of cable terminators are each configured to couple with a respective multi-conductor cable exiting the second section of a respective passageway. Each cable terminator includes a plurality of pins each configured to couple with a respective conductor of the multi-conductor cable and to extend to a respective contact surface. The contact surfaces of the plurality of cable terminators extend to a second plane. The first plane and the second plane are coplanar when the array is in the connection position.