A temperature measurement module is for measuring the temperature of a temperature measurement target and includes a flexible printed circuit board that includes an insulating sheet member and circuit patterns routed in the sheet member, a temperature sensor attached to the flexible printed circuit board, and a heat transfer member thermally fixed to the temperature sensor. The sheet member is provided with through holes located outward of a region overlapped with the temperature sensor, and the heat transfer member includes heat receiving portions that are arranged inside the through holes and receive heat from the temperature measurement target.

A light source module includes a light-emitting device having an upper surface and a lower surface and including: at least one light-emitting element and a plurality of conductive regions on the upper surface of the light-emitting device; a mounting substrate having an upper surface on which a lower surface side of the light-emitting device is located, the mounting substrate including conductive patterns on the upper surface of the mounting substrate, each conductive pattern including a device-side connecting portion and an external side connecting portion; and a plurality of conductive members each having a first end bonded to a respective one of the device-side connecting portion and a second end opposite to the first end, the second end being in contact with a respective one of the conductive region by elasticity to electrically connect the respective one of the conductive regions and a respective one of the conductive patterns.

An integrated circuit printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.

An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.

An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Embodiments described herein may be related to apparatuses, processes, and techniques related to a shielding layer to be inserted under an inductor footprint to mitigate the impact of electromagnetic interference (EMI) onto electrical traces beneath the shielding layer and under the inductor footprint. In embodiments, the electrical traces may be high-speed input/output (HSIO) traces that may be particularly susceptible to data corruption given the level of EMI. In embodiments, the shielding layer may be a high density metallization shield within dielectric stack-up layers. In embodiments, these layers may use unique via patterns or shaped metal preform shields to enable routing under an inductor at a higher layer of the PCB. Other embodiments may be described and/or claimed.

A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.

A light source module includes a light-emitting device having an upper surface and a lower surface and including: at least one light-emitting element and a plurality of conductive regions on the upper surface of the light-emitting device; a mounting substrate having an upper surface on which a lower surface side of the light-emitting device is located, the mounting substrate including conductive patterns on the upper surface of the mounting substrate, each conductive pattern including a device-side connecting portion and an external side connecting portion; and a plurality of conductive members each having a first end bonded to a respective one of the device-side connecting portion and a second end opposite to the first end, the second end being in contact with a respective one of the conductive region by elasticity to electrically connect the respective one of the conductive regions and a respective one of the conductive patterns.