A method for manufacturing a circuit board structure with a waveguide is provided. The method includes: providing a first substrate unit, a second substrate unit, a third substrate unit, and two adhesive layers, the first substrate unit including a first dielectric layer and a first conductive layer, the first conductive layer including a first shielding area and two first artificial magnetic conductor areas disposed on two sides of the first shielding area; the second substrate unit including a second dielectric layer and a second conductive layer, the second conductive layer including a second shielding area; the third substrate unit defining a first slot, and the adhesive layer defining a second slot; stacking the first substrate unit, one of the adhesive layers, the third substrate unit, another one of the adhesive layers, and the second substrate unit in that order; pressing the intermediate body.

An electromagnetic wave transmission board proofed against internal signal leakage includes an inner plate, a first outer plate, a second outer plate, a first plate bump, a first conductive bump, a second plate bump, and a second conductive bump. The inner plate defines a first through hole with a plated metal layer on the hole wall. The first and second plated bumps are disposed between the first outer and inner plates. The second plate bump and the second conductive bump are disposed between the second outer plate and the inner plate. The plate metal layer, the first plate bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump jointly form an air-filled chamber. A method for manufacturing the electromagnetic wave transmission board is also provided.

A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.

A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board.

A transition structure between a transmission line of a multilayer PCB and a waveguide is proposed. The transition structure includes the waveguide comprising an interior space on one side thereof and having an inlet for accommodating a part of a stripline, the transmission line comprising a first ground layer of the multilayer PCB composed of at least two or more dielectric layers, the stripline extending from the transmission line and protruding into the waveguide through the inlet of the waveguide, and a single via hole or a plurality of via holes formed between the first ground layer and a bottommost ground layer, wherein each via hole is positioned at the inlet of the waveguide.

A method is provided for forming waveguides in a PCB. The method may include forming an opening in a PCB core comprising a plurality of conductive layers interleaved with a plurality of insulating layers, the opening extending from a first side of the PCB core to a second side of the PCB core. The method may also include filling the opening with metal. The method may also include forming a cavity enclosed by sidewalls by removing a first portion of the filled opening, the cavity extending from the first side of the PCB core to the second side of the PCB core. A second portion of the filled opening is a heat transfer element configured to transfer heat from the first side of the PCB core to the second side of the PCB core. The at least one waveguide is embedded within the heat transfer element and configured for transmitting signals from the first side to the second side.

This document describes techniques, apparatuses, and systems for an antenna-to-printed circuit board (PCB) transition. An apparatus (e.g., a radar system) may include an MMIC or other processor to generate electromagnetic signals. The apparatus can include a PCB that includes multiple layers, a first surface, and a second surface that is opposite and in parallel with the first surface. The PCB can also include a dielectric-filled portion formed between the first surface and second surface. The apparatus can also include a conductive loop located on the first surface and connected to a pair of lines. The apparatus can further include a transition channel mounted on the first surface and positioned over the dielectric-filled portion. The described transition can reduce manufacturing costs and board sizes, reduce energy losses, and support a wide bandwidth.

A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a microwave structure embedded at least partially in the stack. The microwave structure configured for exciting a microwave propagation mode and having at least two stack pieces being interconnected with each other at an electrically conductive connection interface.

A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.

A radio-frequency device comprises a printed circuit board and a radio-frequency package, which is mounted on the printed circuit board at a first mounting point and has a radio-frequency chip and a radio-frequency radiation element, wherein the printed circuit board has a first elasticity at least in a first section comprising the first mounting point. The radio-frequency device further comprises a waveguide component, which is mounted on the printed circuit board at a second mounting point and has a waveguide, wherein the radio-frequency radiation element is configured to radiate signals into the waveguide and/or to receive signals by way of the waveguide. The printed circuit board has a second elasticity at least in a second section with an increased elasticity between the first mounting point and the second mounting point, wherein the second elasticity is higher than the first elasticity.