An optic configuration including a PCBA with one or more LEDs mounted thereon to emit light through a lens and a reflector. The optic configuration may be assembled within a cavity of a lighting fixture. At least a portion of the emitted light may be subtended by the lens, such that the lens may subtend light through a number of regions (e.g., three distinct regions). At least a portion of the emitted light may be subtended by the reflector, such that the reflector may subtend light from a number of surfaces (e.g., four surfaces). At least a portion of the light subtended by the lens may further be subtended by the reflector. The light subtended by the lens and/or the reflector may form a beam pattern including a high intensity spot portion and a lower intensity flood portion.

A substrate for a tamper sensor includes a plurality of walls and a tab. The walls define a protective volume with an open side. The walls have a plurality of open edges adjacent the open side and a plurality of interior edges different from the open edges. The tab extends from one of the interior edges of one of the walls and is disposed within the protective volume.

Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.

A circuit board having a power supply, an electrical device having a circuit board, and a method for producing a circuit board are disclosed. In an embodiment a circuit board includes a power supply, a carrier substrate and an energy store with a first layer stack having a first electrode layer with a first electrode, a second electrode layer with a second electrode, and an electrolyte layer arranged therebetween, which has an electrolyte, wherein the first electrode, the second electrode and the electrolyte are solid states.

An embodiment relates to a controller and a motor assembly comprising same, the controller comprising: a substrate; a controller housing disposed on the substrate; a CM filter unit disposed between the substrate and the controller housing; a DM filter unit disposed under the CM filter unit; a controller cover disposed between the substrate and the DM filter unit; a power module unit disposed between the substrate and the controller cover; and a connector unit coupled to the substrate, wherein the power module unit comprises a power module and a mold unit surrounding the power module. Accordingly, the heat generating problem of the power module unit can be resolved.

Disclosed is an electronic device. The electronic device includes: a housing including a side wall at least partially configured as an antenna, a first printed circuit board disposed in the housing and including at least one ground part, a second printed circuit board, wherein the second printed circuit board includes an extension part extending along the side wall of the housing, a first part extending from one end of the extension part and connected to the first printed circuit board, and a second part extending from an opposite end of the extension part and electrically connected to the at least one ground part, at least one component disposed on the extension part, and a processor disposed on the first printed circuit board, and operatively connected to the at least one component through the first part of the second printed circuit board.

A temperature measurement device includes: a case fixed to a measurement target product; a flexible printed circuit board attached to the case; and a thermistor element mounting portion having a thermistor element to be electrically connected to a wiring provided on the flexible printed circuit board, the case has a holding portion for holding the thermistor element mounting portion and a support portion for supporting the holding portion, the holding portion is connected through a hinge portion to a case body provided with the support portion, and the holding portion is supported by the support portion in such a manner that the holding portion is folded back to bend the hinge portion.

An electronic control device includes a board including a heat sink on which a heat generation element is mounted, and a housing that is in contact with the board and dissipates heat of the heat generation element to the outside. A potential of the housing is a ground, and a potential of the heat sink is a non-ground. The board includes a first layer including a first non-ground wiring that is in direct contact with the heat sink, and a second layer including a second ground wiring that is in electrical and thermal contact with the housing. The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board.

A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.

A controller including a first housing; a first cover disposed on an opening of the first housing; filter units disposed above the first cover; a power module unit disposed below the first cover; and a substrate disposed below the power module unit; wherein the power module unit includes a bracket; and a power module disposed between the bracket and the first cover, and wherein the power module includes a power module body; a plurality of first pins arranged to protrude downward from one side of the power module body; and five terminal pins arranged to protrude downward from the other side of the power module body, wherein an end portion of the first pin is coupled to the substrate.