The proposed invention relates to a camera module with an optical image stabilization function. A flexible printed circuit board (FPCB) electrically connected to an image sensor is implemented to serve as an electrical path and at the same time, serve to provide an elastic restoring force in directions of a plurality of axes, thereby further miniaturizing and lightening the camera module.

An electronic component housing package includes an insulating substrate including a first surface with a mounting region mounting an electronic component, a second surface located opposite to the first surface, a plurality of side surfaces located between the first surface and the second surface, and a corner portion located between two of the side surfaces; an external connection conductor located on the second surface; and a corner conductor connected to the external connection conductor. The corner conductor is located from the external connection conductor toward the corner portion in a manner to increase the distance from the second surface.

An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.

The present disclosure relates generally to providing a flexible patch and system for communicating through hard plastic masks such as CPAP/BiPAP® masks. Using electronic circuitry and novel designs, the present systems and methods can detect speech vibrations and output audible speech from hard plastic mask wearers. For example, in certain embodiments, the present systems and methods can recognize speech through a CPAP/BiPAP® mask, filter out non-human voice related noise, and output the resulting speech of the mask wearer.

A fluid driving system includes a vibration unit, a piezoelectric element, a signal transmission layer, a plane unit, and a protrusion. The piezoelectric element includes a first electrode and a second electrode electrically isolated from each other. The signal transmission layer includes a first conductive zone and a second conductive zone. The first electrode of the piezoelectric element is electrically connected to the first conductive zone of the signal transmission layer, and the second electrode of the piezoelectric element is electrically connected to the second conductive zone of the signal transmission layer. The plane unit has at least one hole. The piezoelectric element, the signal transmission layer, and the plane unit are located at one side of the vibration unit. The protrusion is located between the vibration unit and the plane unit, and the protrusion corresponds to and protrudes toward the at least one hole.

A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.

A micro-speaker includes a frame body, a diaphragm on the frame body, a magnetic structure and a voice coil in the frame body. An upper end of the voice coil is fixed to the diaphragm. The magnetic structure is arranged under the voice coil. A voice coil balancing system is provided in the frame body, which is composed of two symmetrically arranged dampers, which are respectively arranged under two ends of a long axis of the voice coil and fixed with glue. Each of the dampers is made of a flexible circuit board, including a first end, a second end and a cantilever connecting the first end and the second end. A ratio of a length L of the cantilever to a distribution distance D of the cantilever is between 2-15.

The present disclosure relates to a speaker and a magnetic circuit system thereof. The speaker includes a housing and at least one magnetic circuit system and at least one vibration system arranged in the housing. The at least one vibration system includes at least one layer of drive circuit configured to generate mechanical motion under the action of a magnetic field of the at least one magnetic circuit system, and a diaphragm driven by the at least one layer of drive circuit. The at least one layer of driving circuit is mounted to the diaphragm and has a planar shape. Since the driving circuit of the vibration system has a planar shape, the thickness of the speaker of the present disclosure can be effectively reduced.

In some examples, a package comprises a semiconductor die having a first surface and a second surface opposing the first surface, the semiconductor die including circuitry formed in the first surface. The package includes an acoustic waveguide in the semiconductor die, the acoustic waveguide including an array of capacitors. The array of capacitors includes a transducer portion and a diffraction grating portion. The transducer portion is configured to convert signals between electrical signals and acoustic waves, and the diffraction grating portion is configured to direct the acoustic waves toward and receive the acoustic waves from the second surface.

Described herein is mechanically decoupling of an electromechanical transducer from a common substrate, enabling multiple transducers to be surface mounted to a common substrate such as a printed circuit board (PCB) without experiencing mechanical cross-coupling. The decoupling of the transducer from the substrate enables the transducers to be attached without reducing the efficiency of acoustic transduction. The design of the mount enables it to be assembled in an automated manner with pick and place tools.