Embodiments presented in this disclosure generally relate to techniques for interconnecting integrated circuits. More specifically, embodiments disclosed herein provide a back mounted interposer (BMI) to facilitate interconnecting of integrated circuits. One example apparatus includes an integrated circuit, an interposer, and a circuit board, at least a portion of the circuit board being disposed between the integrated circuit and the interposer, where the circuit board is configured to provide electrical connection between the interposer and the integrated circuit via connection elements on a first surface of the interposer. The apparatus also includes an interface on a second surface of the interposer, the interface being configured to provide signals from the integrated circuit to an electrical component.

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

An automated and/or motorized spatial frame including a control unit and a plurality of motorized struts is disclosed. The control unit being configured as a controller for exchanging data with an external computing system, exchanging data with the plurality of motorized struts, and delivering power to the motorized struts. Thus arranged, the control unit may be configured as a fully integrated power supply and controller for powering and controlling the motorized struts. In some embodiments, the control unit includes a plurality of PCB modules, each positioned within the spaces or pockets formed between adjacent tabs on a ring of the frame. The PCB modules being detachably coupled to the ring. In some embodiments, the PCB modules may be detachably coupled to the ring via interconnecting male and female connectors. Alternatively, the PCB modules may be detachably coupled to the ring via a plurality of brackets.

Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.

Provided is a matable electrical connection structure including a female connection member and a male connection member respectively including a plurality of first connection portions and a plurality of second connection portions, and a plurality of matable connection portions configured to detachably couple the female connection member and the male connection member, and respectively and electrically connect the plurality of first connection portions to the plurality of second connection portions, and the matable connection portions include inner conductive materials respectively and electrically connected to the plurality of first connection portions and provided on inner walls of a plurality of insertion holes formed in the female connection member, columns respectively and electrically connected to the plurality of second connection portions and configured to protrude from the male connection member to be inserted into the insertion hole, and elastic fins configured to extend outside the column to elastically contact the inner conductive material, and at least one of the female connection member and the male connection member is divided into a plurality of areas, and the plurality of matable connection portions are disposed to form a group in each of the areas.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

A heat sink assembly includes a casing having an opening, a main board accommodated in the casing, a heat sink mounted on the main board, an electrical connector mounted on the main board and exposed in the opening, a mating connector located outside the casing and connected to the electrical connector through the opening in a plugging manner, and a heat conductor, disposed inside the casing. The mating connector has a chip that is electrically connected to the electrical connector. One end of the heat conductor is connected to the heat sink, and the other end of the heat conductor is thermally connected to the electrical connector or the mating connector, so that heat generated by the chip during working can be transferred to the heat sink through the heat conductor, thereby reducing a temperature of the mating connector.

Back plates to support integrated circuit packages in sockets on printed circuit boards and associated methods are disclosed. An example back plate includes a ceramic substrate having a first surface and a second surface opposite the first surface. The example back plate further includes metal coupled to the ceramic substrate. At least a portion of the metal is disposed between planes defined by the first and second surfaces of the ceramic substrate.

The disclosure relates to electronics of an electric motor of a motor vehicle, having a connection unit that is placed in electrical contact with a circuit board and attached thereto. The connection unit has a number of leadframes that are stabilized with respect to one another. The connection unit at least partly forms a connector socket for a mating connector, and the connection unit at least partly forms a contact point for an electromagnet of the electric motor.