Patent classifications
H05K2201/10439
OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE
An optical module includes: an optical element; a housing configured to house the optical element; as electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing; and a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal.
Component carrier with embedded component and horizontally elongated via
A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, a component embedded in the stack, and a via formed in the at least one electrically insulating layer structure along a horizontal path having a length being larger than a horizontal width.
Circuit board and display device having the same
A display device includes a display panel including a curved surface bent along a first direction, a circuit board coupled to the display panel, the circuit board being bent along the first direction in correspondence to the curved surface of the display panel, and an integrated circuit (IC) chip on the circuit board, a short side of the IC chip extending along the first direction.
COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATED VIA
A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, a component embedded in the stack, and a via formed in the at least one electrically insulating layer structure along a horizontal path having a length being larger than a horizontal width.
Wiring board
A wiring board includes a substrate, a connector on the substrate, and at least one monolithic ceramic capacitor including a pair of electrodes and mounted at a mounting angle on the substrate. The connector has an insertion-removal position at which a stress starts in insertion and removal of a counterpart connector into and from the connector. When a first line segment connects centers of the electrodes in a plan view, and a second line segment connects a center of the insertion-removal position and a center of the first line segment in the plan view, the mounting angle is an angle between the first line segment and the second line segment and is from 0 to 90 degrees. The mounting angle is from 0 to 5 degrees or from 85 to 90 degrees in an area within 10 mm from a periphery of the connector on the substrate.
Stretchable circuit board and strain sensor
A stretchable circuit board includes a stretchable substrate, a stretchable conducting film placed on one surface of the stretchable substrate and elongated in a first direction, an electric element placed on the one surface of the stretchable substrate, and a covering portion that covers a part of the stretchable conducting film and at least a part of the electric element, wherein, when an area of a first section as a section along an outer circumference of the covering portion in the stretchable conducting film is referred to as a first area and an area of a second section as a section of the stretchable conducting film orthogonal to the first direction in a location apart from the outer circumference of the covering portion toward outside is referred to as a second area, the first area is larger than the second area.
CIRCUIT BOARD
A circuit board includes a substrate and a first metal circuit layer. The substrate has an upper surface and a lower surface opposite to the upper surface. The first metal circuit layer is located on the upper surface, and the first metal circuit layer includes a first line area and a second line area. The first line area and the second line area are separated by a groove area, and the groove area includes a bent section. Accordingly, the risk of detachment between the first metal circuit layer and the substrate due to stress concentration on the circuit board can be reduced.
STRETCHABLE CIRCUIT BOARD AND STRAIN SENSOR
A stretchable circuit board includes a stretchable substrate, a stretchable conducting film placed on one surface of the stretchable substrate and elongated in a first direction, an electric element placed on the one surface of the stretchable substrate, and a covering portion that covers a part of the stretchable conducting film and at least a part of the electric element, wherein, when an area of a first section as a section along an outer circumference of the covering portion in the stretchable conducting film is referred to as a first area and an area of a second section as a section of the stretchable conducting film orthogonal to the first direction in a location apart from the outer circumference of the covering portion toward outside is referred to as a second area, the first area is larger than the second area.
ANTENNA MODULE
Disclosed herein is an apparatus that includes a multilayer substrate including a plurality of conductive layers and a plurality of insulating layers alternately stacked, and an electronic component having a first signal pad. The plurality of conductive layers include a first internal conductive layer having a first signal pattern, and a second internal conductive layer having a second signal pattern. The plurality of insulating layers include a first insulating layer positioned between the first and second internal conductive layers. The electronic component is embedded in the first insulating layer such that the first signal pad is connected to the first signal pattern. The first and second signal patterns are connected to each other by a first via conductor penetrating through the first insulating layer. The distance between the electronic component and the first via conductor is greater than a diameter of the first via conductor.
SEMICONDUCTOR DEVICE
An electrode surface of a horizontal semiconductor chip and a substrate are joined together through a plurality of first joint portions including a plurality of joint portions at which a plurality of electrodes formed on the electrode surface are joined to the substrate. A no-electrode surface of the horizontal semiconductor chip and a heatsink are joined together through a second joint portion at which the no-electrode surface and the heatsink are joined together. In a plan view from a direction normal to a principal surface of the substrate, when a region inside the outline of the rough shape of an aggregate of the first joint portions is a first joint region and a region inside the outline of the second joint portion is a second joint region, the first joint region and the second joint region are the same in position, shape, and size.