A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

A connecting member for electrically connecting a circuit board and a component in an electronic device is provided. The connecting member includes at least one bending part configured to comprise elasticity, a pad part connected to the bending part and configured to be attached to one surface of the circuit board, and a fixing part extending from the pad part and configured to fix the connecting member to the circuit board.

A method for constructing a wireless communications apparatus includes attaching a three dimensional antenna having a first end and a second end to a printed circuit board (PCB) using a spring-loaded attachment mechanism. The three dimensional antenna is attached in an orientation that is perpendicular to a mounting surface of the PCB. The first end of the three dimensional antenna is further soldered to the PCB.

An assembly comprises a circuit board structure and a plurality of connection portions. The circuit board structure has a main circuit board and a supplemental circuit board. The main circuit board is formed with an accommodating portion. The accommodating portion is recessed downward in an up-down direction from an upper surface of the main circuit board. The main circuit board has a plurality of upper main conductive portions which are formed on the upper surface of the main circuit board. The supplemental circuit board has a plurality of upper supplemental conductive portions which are formed on an upper surface of the supplemental circuit board. The supplemental circuit board is, at least in part, accommodated in the accommodating portion. Each of ones of the connection portions connects a respective one of the upper main conductive portions and a respective one of the upper supplemental conductive portions with each other.

Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.

An electrical connector including an insulating body, a plurality of terminals disposed in the insulating body, a first metallic shell enclosing the insulating body to form an interface for being plugged by another electrical connector, and a second metallic shell is provided. The first metallic shell has a first soldering leg close to the interface, and the second metallic shell encloses the first metallic shell, wherein the first soldering leg extends away from the insulating body, penetrates the second metallic shell and protrudes out of the second metallic shell.

An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.

The present disclosure is directed to a board mounted active component assembly that includes a printed circuit board to which a connector is mounted and electrically connected. In one aspect, the connector includes a housing defining an adapter port for receiving an optical plug. The connector also includes a fiber optic transceiver module secured within the housing such that the transceiver module is optically aligned with an optical plug received in the adapter port. The fiber optic transceiver module includes a transmitter optical sub-assembly (TOSA) and a receiver optical sub-assembly (ROSA) with leads connected to a circuit on the printed circuit board.

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole.