A double-sided flexible circuit board includes a flexible substrate, a first circuit layer, a second circuit layer, an insulating protection layer and a plurality of through circuit lines. The first and second circuit layers are located on a top surface and a bottom surface of the flexible substrate, respectively. The insulating protection layer covers a supporting line of the second circuit layer such that the supporting line is located between the flexible substrate and the insulating protection layer. The insulating protection layer can provide electrical insulation to the supporting line of the second circuit layer to avoid short circuit conditions of the double-sided flexible circuit board during test.

An electromagnetic wave transmission board proofed against internal signal leakage includes an inner plate, a first outer plate, a second outer plate, a first plate bump, a first conductive bump, a second plate bump, and a second conductive bump. The inner plate defines a first through hole with a plated metal layer on the hole wall. The first and second plated bumps are disposed between the first outer and inner plates. The second plate bump and the second conductive bump are disposed between the second outer plate and the inner plate. The plate metal layer, the first plate bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump jointly form an air-filled chamber. A method for manufacturing the electromagnetic wave transmission board is also provided.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin disposed to cover the first surface and the first component; a shield film covering at least a side surface of the first sealing resin; a first ground terminal mounted on the first surface; and a protruding portion formed to extend laterally at any position of the first ground terminal in a direction perpendicular to the first surface. The protruding portion is electrically connected to a portion of the shield film that covers the side surface of the first sealing resin.

Systems, methods, and apparatus that employ a connector assembly having a substrate layer with an inner aperture and an outer periphery, and one or more signal traces disposed on the substrate that extend from an inner first location to an outer second location of the apparatus, for communicating data between electronic devices positioned within an interior volume of an enclosed vessel and complementary electronic devices positioned in an ambient environment external to the enclosed vessel. An inner connector is conductively connected the signal traces at the inner first location of each signal trace, and an outer connector is conductively connected to the one or more signal traces at the outer second location of each signal trace. A substantially flat exterior surface extends radially over at least a portion of a region between the respective first locations and the respective second locations.

In an electro-optical device, a first substrate is provided with a temperature detection element and an electro-static protection circuit that protects the temperature detection element from a surge current. A first resistor element is electrically coupled to the temperature detection element in series. The electro-static protection circuit includes a transistor electrically coupled to the first resistor element and the temperature detection element in parallel. A first capacitance element is provided on a wiring substrate electrically coupled to the first substrate, and is provided between a first coupling wiring line electrically coupled to one side of the temperature detection element and a second coupling wiring line electrically coupled to the other side thereof.

Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

An electronic circuit card comprises a printed circuit board (PCB) with electronic components thereon. The electronic components comprise drivers for transmitting TX signals and receivers for receiving RX signals, according to several groups of interface signals. There is further provided a connector edge, arranged at an edge of the card, and configured to allow the card to be connected to an external connector. This connector edge comprises two subsets of symmetric pins on respective (opposite) sides thereof. The drivers and the receivers are connected to the pins, for respectively conveying the TX signals and the RX signals. Pins are assigned such that, for each of the several groups of supported interface signals, any pin (of any of the subsets) connected to transmit TX signals is located opposite a pin (of the other subset) connected to receive RX signals. Pairs of consecutive pins (on each side) typically come in differential pairs.

A circuit board includes a conductive plate held by a holding member, an insulation sheet provided on one side of the conductive plate, and a circuit component that is placed on the conductive plate and that has a terminal, and a void portion is formed in the insulation sheet, and a conductive material for electrically connecting the conductive plate and the terminal to each other is applied to a region that is exposed from the void portion on the one side of the conductive plate.

A radio frequency module includes a module substrate having a main surface, a first circuit component arranged on the main surface, a resin member arranged on the main surface and covering a side surface of the first circuit component, a metal shield layer in contact with a top surface of the resin member and a top surface of the first circuit component, and an engraved portion provided on the top surface of the resin member. When the main surface is viewed in plan, the engraved portion does not overlap the first circuit component.

Systems, methods, and apparatus that employ a connector assembly having a substrate layer with an inner aperture and an outer periphery, and one or more signal traces disposed on the substrate that extend from an inner first location to an outer second location of the apparatus, for communicating data between electronic devices positioned within an interior volume of an enclosed vessel and complementary electronic devices positioned in an ambient environment external to the enclosed vessel. An inner connector is conductively connected the signal traces at the inner first location of each signal trace, and an outer connector is conductively connected to the one or more signal traces at the outer second location of each signal trace. A substantially flat exterior surface extends radially over at least a portion of a region between the respective first locations and the respective second locations.