A UV reactor for disinfecting water and including a UV source printed circuit board assembly transfers heat to a heat sink in the form of a water facing thermal coupler. The UV source printed circuit board assembly may include a metal clad printed circuit board having a thermal contact region in thermal communication with the heat sink.

Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

A connection method for a chip and a circuit board includes: placing the circuit board on the chip, the circuit board having a first surface in contact with the chip having a plurality of contacts, and the circuit board having a plurality of through holes aligned with the plurality of contacts respectively; placing a mask on a second surface of the circuit board, the mask having a plurality of openings aligned with the plurality of through holes respectively; covering a surface of the mask with a conductive adhesive to fill the plurality of through holes with the conductive adhesive; and keeping portions of the conductive adhesive that are respectively in the plurality of through holes to be spaced apart from each other. The portions of the conductive adhesive that fill the plurality of through holes remain to provide an electrical connection between the circuit board and the chip.

An electronic component sub-mount includes a body having a top surface, a bottom surface, and a supporting surface. The top and bottom surfaces are located on opposite sides of the body. The supporting surface is located on one side of the body, and an angle that is not equal to 0 degrees is formed between the supporting surface and the bottom surface. A first conductive layer is disposed on the bottom surface and includes multiple first conductive lines. A second conductive layer is disposed on the supporting surface, extending to the top surface, and includes multiple second conductive lines. The second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout different from the first pin layout. The second pin layout matches the pin layout of first conductive lines on the bottom surface.

Discussed is a battery pack including a battery cell that can include a pair of electrode leads including a positive electrode lead and a negative electrode lead, a pack housing configured to receive the battery cell therein, and a protection circuit module (PCM) having a protection circuit formed on a printed circuit board (PCB), the protection circuit being configured to control operation of the battery cell, wherein the pair of electrode leads may be directly bonded to a surface copper foil layer of the PCB. The pair of electrode leads may be directly bonded to the surface copper foil layer of the PCB by a laser welding.

An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.

An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

An electronic device is downsized while suppressing performance degradation of the electronic device. In the electronic device, a power module including a power transistor is arranged in a first region on a back surface of a through hole board having a plurality of through hole vias having different sizes while a pre-driver including a control circuit is arranged in a second region on a front surface of the board. In this case, in a plan view, the first region and the second region have an overlapping region. The power module and the pre-driver are electrically connected to each other via a through hole via. The plurality of through hole vias include a through hole via having a first size, a through hole via which is larger than the first size and in which a cable can be inserted, and a through hole via in which a conductive member is embedded.

A printed substrate includes a land that is to be soldered. The land includes a plating film that defines a surface of the land. The plating film includes a metal as a main constituent and a pi-acceptor molecule that is dispersed in the plating film. The pi-acceptor molecule has pi-acceptability and causes ligand field splitting equal to or greater than that of 2,2′-bipyridyl in spectrochemical series. A content of the pi-acceptor molecule in the plating film is equal to or greater than 0.1 weight percent, in terms of carbon atoms, with respect to the metal of the plating film.