An electrical connector is provided. The electrical connector is to be attached to a cloth in which a conductive pattern is formed. The electrical connector includes an insulating housing having a boss portion provided on a surface of the housing, where the surface is to be in contact with the cloth, and the boss portion is inserted into the cloth; a connection terminal provided to the housing; and a conductive pad provided around the boss portion on the surface of the housing, where the surface is to be in contact with the cloth, and the conductive pad is electrically connected to the connection terminal. The conductive pad has a protrusion protruding in the same direction as the boss portion of the housing protrudes.

A terminal module includes a number of conductive terminals. The conductive terminals include a first signal terminal and a second signal terminal. A contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The first contact arm includes a first contact end portion and a first contact arm body portion connected with the first contact end portion. The first contact arm body portion includes a first end connected to the first contact end portion and a second end opposite to the first end. From the first end to the second end, a width of the first contact arm body portion gradually increases. As a result, it is beneficial to improve the contact impedance when it is mated with a mating backplane connector. The present disclosure also discloses a backplane connector having the terminal module.

A terminal module includes a number of conductive terminals. The conductive terminal includes a contact portion, a transition portion connected with the contact portion and a connection portion electrically connected with the transition portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The differential signal terminals include a first signal terminal and a second signal terminal. The terminal module further includes a fixing block fixed on the transfer portions of the first signal terminal and the second signal terminal. As a result, a distance between the first signal terminal and the second signal terminal can be controlled by the fixing block for improving the quality of data transmission. The present disclosure also discloses a backplane connector having the terminal module.

A backplane connector includes a housing and a number of terminal modules assembled to the housing. The housing includes a base, a first side wall and a second side wall. The base, the first side wall and the second side wall jointly form a receiving space. The terminal module includes a first signal terminal and a second signal terminal. The housing includes a number of insulating protrusions integrally extending from the base. The insulating protrusions extend into the receiving space. The terminal modules are assembled in the insulating protrusions. Compared with the prior art, the insulating protrusions of the present disclosure is integrally formed with the base, thereby improving the structural strength of the housing and improving the durability of the backplane connector.

A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.

A backplane connector includes a housing and a number of terminal modules. Each terminal module includes a number of conductive terminals, a metal shield surrounding member, a first metal shield and a second metal shield. The conductive terminal includes a mating portion and a tail portion. The conductive terminals include a first signal terminal and a second signal terminal. The metal shield surrounding member surrounds the mating portions of the first signal terminal and the second signal terminal. The first metal shield and the second metal shield are in contact with the metal shield surrounding member. As a result, the shielding area is increased and the shielding effect is improved.

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

A circuit board soldering structure includes lead a plate inserted into a slit hole of a circuit board and soldered to a conductive pattern provided along the slit hole. The lead plate is made of an elastically-deformable metal plate thinner than an opening width (W) of slit hole. The lead plate includes insertion section inserted into the slit hole. The insertion section includes a bent section approaching from one of opposing inner surfaces of the slit hole facing each other toward another of the opposing inner surfaces of the slit hole. The bent section is disposed in the slit hole. The insertion section has both surfaces that are close to or contact corresponding opposing inner surfaces of the slit hole to solder the insertion section to the conductive pattern.

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.