A multilayer circuit board includes a plurality of wiring layers laminated with insulation layers interposed therebetween, the multilayer circuit board further including a solder resist layer that covers a front face wiring layer formed on a front face side insulation layer, in which the front face wiring layer includes a pad for leg terminal to which a leg terminal of a connector is connected, the solder resist layer has an opening part for leg terminal which exposes a part of the pad for leg terminal, a via for leg terminal is provided beneath the pad for leg terminal in a predetermined range straddling a contour line of an opening part for leg terminal, and the via for leg terminal connects a first internal wiring layer with the pad for leg terminal.

A device includes a circuit element, a housing for the circuit element and a terminal for coupling the circuit element to an electrical circuit. The terminal includes an engagement portion and a sleeve portion. The engagement portion is configured to engage a base for the electrical circuit. The sleeve portion couples the engagement portion to the circuit element. The housing encloses the sleeve portion.

The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.

An interlayer connection conductor penetrates through first layers of a multilayer body and projects from an upper surface. In a component mounting substrate, the projection length of the interlayer connection conductor from the upper surface in the lamination direction is adjusted such that a difference between a connection position of the interlayer connection conductor and a conductive bonding portion and a connection position of a connection electrode and a conductive bonding portion in the lamination direction is a difference. A difference between the length of the conductive bonding portion and the length of the conductive bonding portion in the lamination direction is canceled by the difference. As a result, the upper surface and a lower surface are parallel with each other to prevent a high-frequency component from tilting with respect to a mounting substrate, thereby preventing electric connection failure and lowering of bonding strength due to the tilt.

A device includes a circuit element, a housing for the circuit element and a terminal for coupling the circuit element to an electrical circuit. The terminal includes an engagement portion and a sleeve portion. The engagement portion is configured to engage a base for the electrical circuit. The sleeve portion couples the engagement portion to the circuit element. The housing encloses the sleeve portion.

A step etched metal electrical contact including a main body formed from a metal sheet defining a metal tab sized to match a die/device terminal and an electrical clearance aperture, electrical clearance trench, and/or an electrical clearance gaps. A heat sink may be combined with the step etched metal electrical contact to provide double sided module cooling for increased thermal performance of power modules.

An interlayer connection conductor penetrates through first layers of a multilayer body and projects from an upper surface. In a component mounting substrate, the projection length of the interlayer connection conductor from the upper surface in the lamination direction is adjusted such that a difference between a connection position of the interlayer connection conductor and a conductive bonding portion and a connection position of a connection electrode and a conductive bonding portion in the lamination direction is a difference. A difference between the length of the conductive bonding portion and the length of the conductive bonding portion in the lamination direction is canceled by the difference. As a result, the upper surface and a lower surface are parallel with each other to prevent a high-frequency component from tilting with respect to a mounting substrate, thereby preventing electric connection failure and lowering of bonding strength due to the tilt.

The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.

The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.