Disclosed herein are a circuit board and a method of fabricating the same. The circuit board includes: a base substrate having a device mount area defined thereon; a first wiring pattern formed on a first surface of the base substrate; a dummy pattern formed on the base substrate, wherein at least a part of the device mount area is filled with the dummy pattern; a first protective layer covering the first wiring pattern and the dummy pattern; and a lead pattern formed on the first protective layer, wherein the lead pattern is extended to the device mount area.

A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

A press-fit terminal includes a compliant part having a widened part including contact points that protrude to the outermost side along an orthogonal direction (first orthogonal direction Y) orthogonal to an insertion direction X with respect to a through hole of a board and a hole that allows deformation of the widened part toward an inside in the orthogonal direction, and is press-fitted into the through hole 23 along the insertion direction X to come into contact with an inner peripheral surface of the through hole of the board.

Disclosed herein are a circuit board and a method of fabricating the same. The circuit board includes: a base substrate having a device mount area defined thereon; a first wiring pattern formed on a first surface of the base substrate; a dummy pattern formed on the base substrate, wherein at least a part of the device mount area is filled with the dummy pattern; a first protective layer covering the first wiring pattern and the dummy pattern; and a lead pattern formed on the first protective layer, wherein the lead pattern is extended to the device mount area.

A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.

A card edge connector with an improved manner of creating a preload force on conductive elements held by a housing. The housing may include a member and an opening at a mating end. Each conductive element may have a contact portion curving inwardly relative to the opening and a tip extending from the contact portion towards the mating end. Each contact portion may form an electrical connection with an edge pad of a card to be inserted into the opening. The conductive elements may be configured to have a rest state in order to create a proper force to be exerted on the edge pads. The member may preload the conductive elements by contacting the conductive elements from a location farther from the mating end than the contact portion, which may avoid damage upon insertion of a card into the connector without the need for long tips of the conductive elements. As a result, the connector may operate at high frequencies.

A plug contact for electrically contacting a circuit board by inserting the plug contact into a via hole in the circuit board, the plug contact having two flat contact arms that are resilient relative to each other, and a connecting region, from which the two contact arms extend in the plug-in direction of the plug contact, the plug contact being punched as a single piece from a flat metallic material. In the connection region, adjacent to the two contact arms, a recess is formed in the plug contact, the distance between the two contact arms increases from the recess towards the free ends of the contact arms, the two contact arms being spread apart relative to each other and the two contact arms together having a width which is the same as or only slightly smaller than the diameter of the corresponding via hole in the circuit board.

A card edge connector with an improved manner of creating a preload force on conductive elements held by a housing. The housing may include a member and an opening at a mating end. Each conductive element may have a contact portion curving inwardly relative to the opening and a tip extending from the contact portion towards the mating end. Each contact portion may form an electrical connection with an edge pad of a card to be inserted into the opening. The conductive elements may be configured to have a rest state in order to create a proper force to be exerted on the edge pads. The member may preload the conductive elements by contacting the conductive elements from a location farther from the mating end than the contact portion, which may avoid damage upon insertion of a card into the connector without the need for long tips of the conductive elements. As a result, the connector may operate at high frequencies.

A plug contact for electrically contacting a circuit board by inserting the plug contact into a via hole in the circuit board, the plug contact having two flat contact arms that are resilient relative to each other, and a connecting region, from which the two contact arms extend in the plug-in direction of the plug contact, the plug contact being punched as a single piece from a flat metallic material. In the connection region, adjacent to the two contact arms, a recess is formed in the plug contact, the distance between the two contact arms increases from the recess towards the free ends of the contact arms, the two contact arms being spread apart relative to each other and the two contact arms together having a width which is the same as or only slightly smaller than the diameter of the corresponding via hole in the circuit board.