Patent classifications
H05K2201/10916
OPTICAL COMPONENT DRIVING MECHANISM
An optical component driving mechanism is provided. The optical component driving mechanism includes a first movable portion, a fixed portion, a first circuit member, and a first reinforcing component. The first movable portion is connected to the first optical component. The first optical component has a first optical axis. The first movable portion is movable relative to the fixed portion. The first circuit member is disposed on the fixed portion, and the first circuit member is configured to transmit electrical signals. The first reinforcing component is disposed on the first circuit member.
Semiconductor package with guide pin
A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.
Power electronic assembly with an electrically conductive sleeve and with a circuit carrier
A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.
FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING TERMINAL, AND POWER STORAGE MODULE
A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.
ELECTRICAL AND/OR ELECTRONIC COMPONENT AND CONTACT SYSTEM
An electrical and/or electronic component including at least one electrical outside connecting contact. This contact is a terminal lug, which is attached at one side, for the electrical contacting with a contacting partner. The terminal lug includes a connecting side including a planar connecting surface for the electrical contacting. The exposed end of the terminal lug includes a bending leg, which is bent out of the plane by a compensating angle toward the connecting side. The bending leg includes the connecting surface. The terminal lug is designed such that, when a contacting partner, which is planar at least in this area, makes site contact with the free end of the bending leg with a force applied from the connecting side, a position orientation of the connecting surface is adaptable counter to the compensating angle until a gap-free contact is made between the connecting surface and the planar contacting partner.
FLEXIBLE PRINTED WIRING BOARD, BATTERY WIRING MODULE, AND METHOD OF MANUFACTURING FLEXIBLE PRINTED WIRING BOARD
A flexible printed wiring board according to an aspect includes an insulating base film and a conductive pattern stacked on one surface side of the base film. The flexible printed wiring board further includes one or more square-shaped connecting terminals stacked over the conductive pattern with solder in between on one edge side of the conductive pattern. The connecting terminal is made of metal and includes a bent portion with both ends bent opposite to the base film. The connecting terminal includes a plated layer on an outer surface side of the bent portion.
POWER ELECTRONIC ASSEMBLY WITH AN ELECTRICALLY CONDUCTIVE SLEEVE AND WITH A CIRCUIT CARRIER
A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Provided is a circuit board on which a circuit component is mounted on one side, and a recess is formed at a position corresponding to the circuit component on the other side, and the circuit board includes a first heat conductive member that is provided inside the recess and conducts heat generated by the circuit component.
PRINTED CIRCUIT BOARD CABLE CLIP FOR SIGNAL SENSITIVE APPLICATIONS
Technologies and implementations for a clip to connect coaxial cables onto a printed circuit board assembly (PCBA) is disclosed. The technologies and implementations facilitate improved signal integrity from the cable to various components of the PCBA. Additionally, the technologies and implementations help facilitate management of mechanical variations during connection of the coaxial cable.
SEMICONDUCTOR PACKAGE WITH GUIDE PIN
A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.