An optical component driving mechanism is provided. The optical component driving mechanism includes a movable portion, a fixed portion, a driving assembly, and a first circuit member. The movable portion is connected to an optical component. The movable portion includes a side portion. The optical component has an optical axis. The movable portion is movable relative to the fixed portion. The driving assembly includes a coil and a magnetically permeable component. The driving assembly is configured to drive the movable portion to move relative to the fixed portion. The first circuit member is configured to transmit electrical signals. The first circuit member includes a first portion. The first portion is disposed between the coil and the magnetically permeable component. The coil, the magnetically permeable component, and the first portion of the first circuit member are disposed on the side portion of the movable portion.

A driving mechanism for moving a flat optical element is provided. The driving mechanism includes a fixed part, a movable member, and a driving assembly. The movable member is movably disposed on the fixed part and connected to the optical element. The driving assembly is configured to impel the movable member and the optical element to move relative to the fixed part. The driving assembly has a coil disposed on the fixed part.

A haptic feedback system is configured to be disposed on a device, and includes: a fixed portion, a movable portion, a driving assembly, and a first connecting assembly. The fixed portion is fixedly connected to the device. The movable portion is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion for generating feedback to the device. The movable portion is movably connected to the fixed portion via the first connecting assembly, so that the movable portion has a first vibration mode relative to the fixed portion. The driving assembly receives a first signal having a first frequency, and the first frequency is the same as the frequency of the first vibration mode.

Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.

A design method and a packaging method for a PCB board to avoid patch element tombstone, and a PCB board are provided. The method includes: providing at least one patch element placement area on a PCB board, providing pads in each patch element placement area, where each pad group includes two pads, and the two pads are arranged side by side; establishing pad limit areas around the pads; and reflow soldering the patch element to the PCB board. With the above method, the tombstone phenomenon of the patch element can be effectively prevented, the design efficiency is improved, the workload of manual operation of the engineer is reduced, and an error rate is reduced.

Technologies and implementations for a clip to connect coaxial cables onto a printed circuit board assembly (PCBA) is disclosed. The technologies and implementations facilitate improved signal integrity from the cable to various components of the PCBA. Additionally, the technologies and implementations help facilitate management of mechanical variations during connection of the coaxial cable.

A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.

Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.

Technologies and implementations for a clip to connect coaxial cables onto a printed circuit board assembly (PCBA) is disclosed. The technologies and implementations facilitate improved signal integrity from the cable to various components of the PCBA. Additionally, the technologies and implementations help facilitate management of mechanical variations during connection of the coaxial cable.

A grounding structure for power socket includes a grounding main body, which consists of a basic section, a first connecting section, a second connecting section, a grounding section and a contact section. The first and the second connecting section are separately downward extended from two opposite ends of the basic section, such that the basic section and the first and second connecting sections together define a receiving space in between them. The contact section is downward extended from a side edge of the basic section into the receiving space; and the first connecting section is outward bent at its lower end to form the grounding section. And, the grounding section is provided at an outer end with a grounding opening.