Provided is a device configured to manufacture a conductive film including a rotating member, a first syringe, and a second syringe. The rotating member rotates about an axis extending in a first direction. The first syringe is disposed over a first portion of the rotating member, and is configured to discharge a first polymer and conductive balls. The second syringe is adjacent to the first syringe, and is configured to discharge a second polymer.

A printer is configured for printing with conductive ink for applying a conductive pattern to a surface including a wheeling structure for moving the printer over the surface and a transfer unit for applying a layer of electrically conductive ink to the surface. To provide accurate printing with the ability to obtain fine tolerances, the transfer unit has a printing drum rotatable about a printing drum axis and defining a printing drum periphery moving between a first zone and a second zone by rotation of the printing drum. The printing drum periphery, in the first zone, receives the conductive ink and in the second zone transfers the ink to the surface.

It is proposed to provide a transfer method of a high viscosity functional material, such as a conductive paste, onto a receiving substrate, the method comprising the steps of: providing a plate having a cavity surface that includes at least one cavity; providing the cavity with a resistive heating device and control circuitry connected to the heating device; providing a functional material in the at least one cavity, having a material composition that, when heated by the heating device, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the at least one cavity by the gas generation onto the receiving substrate.

Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.

Provided is a device configured to manufacture a conductive film including a rotating member, a first syringe, and a second syringe. The rotating member rotates about an axis extending in a first direction. The first syringe is disposed over a first portion of the rotating member, and is configured to discharge a first polymer and conductive balls. The second syringe is adjacent to the first syringe, and is configured to discharge a second polymer.

Provided is an electrolytic copper foil. The electrolytic copper foil has a drum side and a deposited side, wherein Rz is less than 0.8 m; the electrolytic copper foil has a transverse direction, wherein the electrolytic copper foil is divided into 10 test pieces with the same width and the same length, and each two adjacent ones of the 10 test pieces have a weight deviation therebetween, and a count of the weight deviation(s) greater than or equal to 1.5% is smaller than a count of the weight deviations smaller than 1.5%; wherein n represents any one of the test piece numbers from 1 to 9, and the $\mathrm{weight}\mathrm{deviation}\mathrm{between}\mathrm{each}\mathrm{two}\mathrm{adjacent}\mathrm{ones}\mathrm{of}\mathrm{the}10\mathrm{test}\mathrm{pieces}\left(\%\right)=\frac{\begin{array}{c}.Math.\mathrm{the}\mathrm{weight}\mathrm{of}\end{array}}{}$

A printer is configured for printing with conductive ink for applying a conductive pattern to a surface including a wheeling structure for moving the printer over the surface and a transfer unit for applying a layer of electrically conductive ink to the surface. To provide accurate printing with the ability to obtain fine tolerances, the transfer unit has a printing drum rotatable about a printing drum axis and defining a printing drum periphery moving between a first zone and a second zone by rotation of the printing drum. The printing drum periphery, in the first zone, receives the conductive ink and in the second zone transfers the ink to the surface.

Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

System and method of producing on-demand three-dimensional (3D) printed devices on flexible substrates such as paper, plastic, or polymer using metal alloy nanopowders at low temperatures of printing in the range of 150 degrees Celsius (C) to 300 degrees C. The printer disclosed herein may employ a computer-aided design graphics file given as an input to the printer. The printer will selectively release and print the metal alloy nanopowders on select areas on the substrate to form a conductive pattern.