H05K2203/013

INKJET PRINT SYSTEM AND INKJET PRINTING METHOD USING THE SAME
20230095954 · 2023-03-30 · ·

Disclosed are an inkjet print system and an inkjet printing method using the same. An inkjet print system according to one embodiment of the disclosure may include a stage on which a printing medium is loaded and which moves the printing medium in a first direction, an inkjet head which moves in a second direction perpendicular to the first direction and in which a plurality of nozzles configured to eject an ink on the printing medium are formed, a measurement instrument which moves in the second direction independent of the inkjet head and measures a height for each section of an impacted coating layer on the printing medium, and a processor which allows the nozzles to be opened or closed on the basis of height information of the coating layer.

CURABLE COMPOSITION FOR INKJET, CURED PRODUCT AND FLEXIBLE PRINTED CIRCUIT BOARD

The invention provides a curable composition for inkjet, a cured product, and a flexible printed circuit board. The curable composition for inkjet includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. The curable composition for inkjet has excellent flexibility, and has a withstand voltage of greater than 2 kV even when the thickness is less than 20 μm.

ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING
20230129434 · 2023-04-27 ·

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD FOR PRINTING A FUNCTIONAL LAYER ON A SURFACE OF A THREE-DIMENSIONAL ELECTRONIC DEVICE
20230120298 · 2023-04-20 ·

The present invention relates to an assembly to be used in an inkjet printer, an inkjet printer and a method for printing. The assembly comprises (i) a first fixture configured to hold a first print head; and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section in which a functional layer is printed on a surface of an electronic device, a sintering section spaced apart from the first printing section and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section to the sintering section. The first fixture is movable from one processing line A, B, C, D to another processing line A, B, C, D.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
20220330436 · 2022-10-13 · ·

The present disclosure relates to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, and more specifically, to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, capable of manufacturing a flexible circuit board with a fine line width without undergoing a photolithographic process using a mask.

The substrate processing apparatus and the substrate processing method, for manufacturing a flexible circuit board, according to the present disclosure, can efficiently manufacture a flexible circuit board having a fine line width at low costs.

Method of Manufacturing Printed Circuit Boards

##STR00001##

A method of manufacturing a Printed Circuit Board (PCB) including an inkjet printing step wherein a radiation curable inkjet ink comprising at least one polymerizable compound and at least one photoinitiator is jetted and cured on a substrate, characterized in that the at least one photoinitiator has a chemical structure according to Formula I, wherein X represents a halogen; R1 is selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted and unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted alkyl group and a substituted or unsubstituted aryl or heteroaryl group; R2 and R3 are independently from each other selected from the group consisting of a hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstitited alkoxy group, a substituted or unsubstituted aryloxy group and a halogen; R1 together with R2 and R2 together with R3 may represent the necessary atoms to form a five to eight membered ring.

Method for manufacturing an electronic or electrical system

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

Composite part with integral electronic instrumentation circuit and its manufacturing method
11639916 · 2023-05-02 · ·

A composite part (sandwich or monolithic), including a rigid outer surface, to which is integrated an electronic instrumentation circuit, the electronic instrumentation circuit including a piezoelectric transducer, connected to a coil, an electronic control circuit, connected to a coil positioned facing the coil. The coil is printed on an insulating layer, printed directly on the rigid outer surface, the coil is printed on an insulating layer, covering the coil and the transducer, conducting tracks are printed on an insulating layer printed on at least one portion of the coil to be connected to it, the electronic control circuit being attached to the rigid outer surface and being connected to the tracks.

APPARATUS AND METHOD FOR PRINTING CIRCUITS USING PRINT PARAMETERS ADJUSTED FOR PRINTING CONDITIONS

An apparatus is configured to print a circuit board using conductive and nonconductive printing materials in accordance with parameters. A database stores information correlating characteristics of printing materials with shelf life and/or age of the printing materials, and/or environmental conditions. The apparatus either prompts operator to make printing parameter adjustments or automatically optimizes printing parameters based on information stored in the database and the environmental conditions. The apparatus optionally further optimizes printing parameters based on age of a print head and positioning mechanisms.

ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING
20220380922 · 2022-12-01 ·

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.