Full-automatic microelectronic printer comprising a printing platform, a control component, a feeding component, a camera component, a machine vision device, an ink droplet observation device, and a CAD/CAM system. The printing platform comprises a four-axis linkage system, a printing worktable, a base, a protective housing, an automatic ink cartridge turning device, and an automatic cleaning device; the feeding component comprises a switching control device, an ink cartridge, and an auxiliary processing component; the control component comprises a core control integrated circuit board, a plurality of drive control circuit boards, and a control module interface. The feeding component switches the ink cartridges and the auxiliary processing components to the printing platform in response to the control component which drives the ink cartridges and auxiliary processing components to print, and the protective housing removes fine particles and gas odors. CAD/CAM system assists in designing, generating, and sending instruction to the control component, printing platform, and feeding component to operate and realize full-automatic multi-layer printing.

An apparatus is used in preparing a printed circuit board (PCB). The apparatus can include a common chassis, an inkjet printer mounted on the common chassis, and a pattern exposer mounted on the common chassis. The inkjet printer can selectively print unexposed photosensitive patterns on a PCB substrate with a photosensitive ink. The pattern exposer can expose said photosensitive patterns to radiation thereby defining exposed patterns. A photosensitive ink for use in an ink jet printer can include a photoresist, a solvent, a humectant, a surfactant, an adhesion promoter, and a basic solution. The adhesion promoter is operative to increase anisotropy of a wet etching process of a copper component on which said photosensitive ink is printed.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

A method of forming a conductive pattern includes forming a conductive pattern by ejecting a liquid-state material containing conductive fine particles onto a porous base material, wherein the conductive fine particles have an average particle size of from 1 nm to 200 nm, and the porous base material is formed with a plurality of cavities and includes communication holes through which the plurality of cavities are in communication, an average diameter of the communication holes being less than or equal to the average particle size of the conductive fine particles.

An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.

The disclosure relates to methods for fabricating coreless printed circuit board (PCB) based transformers and/or coreless PCB-based circuits containing one or more coil inductor(s). More specifically, the disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns.

[Problem to be Solved] Provided is a curable composition for inkjet printing, a coating film obtained from which has higher heat resistance than conventional coating films. [Solution] It is a curable composition for inkjet printing, comprising (A) a (meth)acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C) a photopolymerization initiator. Accordingly, an obtained coating film does not crack, has excellent adhesion to a conductor, and maintains sufficient hardness even after a thermal history that corresponds to a plurality of times of soldering. The above problem to be solved is also solved by a curable composition for inkjet printing, comprising (A′) a (meth) acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1′) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2′) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C′) a photopolymerization initiator.

The present invention addresses the problem of providing an ink-jet application type composition for wiring-line protection which can form layers that are excellent in terms of pattern retentivity and moisture resistance at high temperatures, have satisfactory adhesiveness to the circuits or metal wiring lines of the semiconductor device over a long period, and are less apt to suffer ion migration. The ink-jet application type composition for wiring-line protection comprises (A) one or more cationic photopolymerizable compounds including an alicyclic epoxy compound, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, wherein the silane coupling agent is contained in an amount of 1-50 parts by mass per 100 parts by mass of the cationic photopolymerizable compounds. The ink-jet application type composition for wiring-line protection has a viscosity, as measured with an E-type viscometer at 25° C. and 20 rpm, of 5-50 mPa.Math.s.

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.

A manufacturing method of a multilayered board, includes: a dot pattern forming process that forms a dot pattern comprising at least one hemispherical micro-lens shape by repeating a process of forming one hemispherical micro-lens shape by jetting one droplet for forming the dot pattern in an inkjet manner; and a stack pattern forming process that forms a stack pattern having a thickness less than that of the micro-lens by jetting a droplet for forming the stack pattern on a predetermined area around the dot pattern in the inkjet manner.