A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.

A metal pattern forming method has: producing a first base having a pattern of lyophilic portions which have lyophilic properties with respect to a liquid containing a metal component and liquid-repellent portions which have liquid-repellent properties with respect to the liquid containing a metal component; producing a second base which holds the liquid containing a metal component; and transferring the liquid containing a metal component from the second base to the lyophilic portions of the first base by bringing the first base and the second base into contact with each other. With the metal pattern forming method, it is possible to form a metal pattern with high accuracy in which the metal is prevented from adhering to an unnecessary position on the base.

A reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a roller having a cylindrical shape, configured to rotate, and on which a substrate is wound; and a film body that is formed between the roller and the substrate to surround a surface of the roller and is rotatable, wherein the roller and the film body are separately rotated from each other.

The present disclosure relates to a multilayer circuit board manufacturing apparatus. The present disclosure includes: uncoiler configured to provide a member; a process unit configured to perform a process on the member provided from the uncoiler; a recoiler configured to wind the member on which the process is completed in the process unit; and a tension adjustment unit which is located in at least one of the uncoiler, the recoiler, a region between the uncoiler and the process unit, and a region between the process unit and the recoiler, and adjusts tension of the member.

A resist layer forming method includes a process of laminating a resist layer on a base at a first pressure using a laminate roller having a first temperature, and a process of pressing the resist layer against the base at a second pressure higher than the first pressure using a metal plate having a second temperature lower than the first temperature.

Apparatus and methods of applying a pattern onto a web with improved uniformity are provided. One or more micro-contact printing stamps are disposed onto a roll with a seam between each adjacent stamp edge. The micro-contact printing stamps are configured and arranged such that the web always contacts the micro-contact printing stamps to provide a consistent contacting pressure to drive the roll.

A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.

In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.

An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern.

A stretchable contractible wiring sheet includes: stretchable contractible first elastomer sheet; stretchable contractible second elastomer sheet facing and bonded on the first elastomer sheet, and lead that has a transverse section having any cross-sectional shape selected from circular shape, elliptical shape, and track shape, and is plastically deformed in wavy shape periodically curving along longer direction, the lead being interposed between the first elastomer sheet and the second elastomer sheet in a manner that height direction of waves in wavy shape is along in-plane direction of facing surfaces of the first elastomer sheet and second elastomer sheet. The wiring sheet that can be produced easily at low costs, has high flexibility and durability, and undergoes small resistance value change along with stretching and contracting, and stretchable contractible touch sensor sheet.