A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.

A component is disclosed. A component includes an elongated body, with a first end and a second end; and one or more tabs at the first end and the second end, the tabs configured to have a lower tensile strength than other regions of the component.

A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.

The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.

A method for forming resistance on circuit board is provided and includes the following steps. First, a substrate is provided. Next, a second metal layer is provided on the substrate, and the first metal layer is covered by the second metal layer. Then, a resistance is formed on the second metal layer, and the resistance is directly above the first metal layer. Thereafter, the second metal layer is cut so that the edge of the second metal layer is aligned with that of the first metal layer. The second metal layer is separated from the first metal layer. Next, the second metal layer is pressed with a circuit board, and the resistance is attached to a dielectric layer of the circuit board. Then, the second metal layer is etched to form a circuit pattern on the resistance.

Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members. The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.

A method for forming a circuit board having a dielectric core, a foil top surface, and a thin foil bottom surface with a removable foil backing of sufficient thickness to absorb heat from a laser drilling operation to prevent the penetration of the thin foil bottom surface during laser drilling utilizes a sequence of steps including a laser drilling step, removing the foil backing step, electroless plating step, patterned resist step, electroplating step, resist strip step, tin plate step, and copper etch step, which provide dot vias of fine linewidth and resolution.

A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

A method for producing a structure, comprising providing a Composite Conductive Substrate (CCS) with a conductive layer, a non-conductive layer and a release layer, implemented on top of the conductive layer; determining an empty conductive pattern for each layer of the structure; printing a layer of non-conductive matter on the CCS, such that the conductive pattern of the first layer left empty from the non-conductive matter; on top of the release layer, below which the conductive layer is implemented, filling the empty conductive pattern with conductive matter by electroplating; peeling the filled conductive matter or peeling the filled conductive matter and the printed non-conductive matter, from the conductive layer of the CCS.