A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an embodiment, the laser changes the morphology of the exposed region. The method may further comprise etching the core substrate, where the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate. The method may further comprise disposing a via in the hole.

It is proposed to provide a transfer method of a high viscosity functional material, such as a conductive paste, onto a receiving substrate, the method comprising the steps of: providing a plate having a cavity surface that includes at least one cavity; providing the cavity with a resistive heating device and control circuitry connected to the heating device; providing a functional material in the at least one cavity, having a material composition that, when heated by the heating device, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the at least one cavity by the gas generation onto the receiving substrate.

In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

The invention relates to a method for producing a substrate structured by nanowires, characterized in that no lubricant and no lithographic resist mask is used in the method, and only by moving a donor substrate having nanowires relative to a substrate and by locally tribological properties on the surface of the substrate, a specified number of nanowires is deposited selectively at locally defined points of the substrate. The invention further relates to a substrate that can be produced using the method according to the invention, and which selectively contains a specified number of nanowires on a surface at locally defined points. The invention further relates to the use of the substrate according to the invention in microelectronics, microsystems technology, and/or micro-sensor systems.

A method for mounting a component (100) on a workpiece (106), the method comprising obtaining information regarding a surface topography of at least one of a mounting surface (102) of the component and a local surface (108) of the workpiece onto which the component is to be mounted. The method further comprises forming a plurality of deposits (110) of a viscous medium on at least one of the mounting and local surfaces, wherein each of the plurality of deposits has a height (/½, /½, h3) based on the obtained information, and is formed by individually applying at least one droplet (234) of the viscous medium (232) using non-contact dispensing. The method further comprises placing the component on the substrate, such that the plurality of deposits of viscous medium forms a connection between the component and the workpiece.

A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 μm. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.

In a method and an apparatus for forming on a substrate (214) a pattern of a material, a material layer is provided on an intermediate carrier (204) and an adhesive layer is provided on the material layer, wherein at least one of the material layer or the adhesive layer comprises a pattern corresponding to the pattern to be formed on the substrate (214). The material is transferred to the substrate (214) with the adhesive fixing the material to a surface (216) of the substrate (214).