A multilayer board insulating sheet contains a reducing agent.

Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

A composition for forming a conductive film includes at least one of a metal salt (A1) and a metal particle (A2) as component (A) that serves as a metal source of the conductive film, and a metalloxane compound (B). The metal salt (A1) and the metal particle (A2) contain one or more metals selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au. The metalloxane compound (B) has at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain. Preferably, the metal salt (A1) is a carboxylate containing a metal selected from the group consisting of Cu, Ag, and Ni. Preferably, the metal particle (A2) has an average particle diameter of 5 nm to 100 nm and comprises a metal selected from the group consisting of Cu, Ag, and Ni.

A method for forming thin film conductors is disclosed. A thin film precursor material is initially deposited onto a porous substrate. The thin film precursor material is then irradiated with a light pulse in order to transform the thin film precursor material to a thin film such that the thin film is more electrically conductive than the thin film precursor material. Finally, compressive stress is applied to the thin film and the porous substrate to further increase the thin film's electrical conductivity.

An electronic apparatus includes a connection target member that has a first connection portion including copper or copper alloy, a connection terminal that has a second connection portion including copper or copper alloy, the second connection portion mechanically connecting with the first connection portion by spring reaction force of the connection terminal, and a joint portion that is provided with a contact point between the first connection portion and the second connection portion. At least one of the first connection portion and the second connection portion includes an oxide film at a periphery of the joint portion on a surface thereof, the oxide film including copper oxide. The joint portion directly joints copper included in the first connection portion and copper included in the second connection portion metallurgically.

Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

Provided is a novel printing process for fabricating metallic, conductive and transparent ultra-thin nanowires and patterns including same on a substrate. The process includes two different controllable steps, each designed to achieving a useful and efficient pattern.

A process for printing a metal wire pattern on a substrate, including: printing a first salt solution including a metal ion that will undergo a reduction half-reaction; printing a second salt solution containing an oxidizing agent that will undergo an oxidation half-reaction in contact with the first salt solution, resulting in the reduction of the metal ions of the first salt solution; and allowing the first and second salt solutions to react by a galvanic reaction, causing reduced metal ions of the first salt solution to precipitate as a solid, on the substrate.