A desmear module for a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated for a removal of precipitates comprising a desmear container connectable to a desmear unit, a pump and at least a first liquid connection element for connecting said pump with the desmear unit, wherein said pump is in conjunction with said desmear unit by said at least first liquid connection element; and wherein a treatment liquid level is provided inside the desmear module, which is above an intake area of the pump; wherein the desmear module further comprises at least a first liquid area, at least an adjacent second liquid area comprising the intake area of the pump, and at least a first separating element arranged between said at least first liquid area and said at least second liquid area.

A filling assembly for filling holes formed in a board with a filling material, including: a board holding device having a carrier frame formed by frame elements to hold the board; a filling device arranged on a side of the carrier frame and includes a filling material feeding device with a filling head to provide filling material to the board, wherein the filling head is movable relative to the carrier frame parallel to the carrier frame surface; a screen holding frame formed by screen holding frame elements to hold a screen between the carrier frame and the filling device, wherein the screen includes a screen cloth surrounded by a screen frame; and a fixing device with an expansion element arranged in a frame element, wherein the expansion element can provide a temporary compressive force to the screen frame to fixedly press the screen frame against a screen holding frame.

An etching device includes a nozzle unit including at least one nozzle including an etching solution injection hole, an etching solution collection hole, and a sealing part. The etching solution injection hole is configured to provide an etching solution to an etching object, the etching solution collection hole is configured to collect the etching solution, and the sealing part surrounds the etching solution injection hole and the etching solution collection hole to prevent the etching solution from leakage.

Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

A filling assembly for filling holes formed in a board with a filling material, including: a board holding device having a carrier frame formed by frame elements to hold the board; a filling device arranged on a side of the carrier frame and includes a filling material feeding device with a filling head to provide filling material to the board, wherein the filling head is movable relative to the carrier frame parallel to the carrier frame surface; a screen holding frame formed by screen holding frame elements to hold a screen between the carrier frame and the filling device, wherein the screen includes a screen cloth surrounded by a screen frame; and a fixing device with an expansion element arranged in a frame element, wherein the expansion element can provide a temporary compressive force to the screen frame to fixedly press the screen frame against a screen holding frame.

A membrane circuit board includes a first flexible circuit board, a second flexible circuit board and a nanomaterial layer. The nanomaterial layer includes plural polymeric structures. The nanomaterial layer is formed on the first flexible circuit board, the second flexible circuit board and/or a junction region between the edge of the first flexible circuit board and the second flexible circuit board to prevent at least one of the upper metallic conductor line and the lower metallic conductor line from contacting with a specified chemical element. Consequently, the conductive impedance of the upper metallic conductor line and the lower metallic conductor line is not affected by the specified chemical element. Moreover, the present invention also provides a keyboard device with the membrane circuit board.

A membrane circuit board includes a first flexible circuit board, a second flexible circuit board and a nanomaterial layer. The nanomaterial layer includes plural polymeric structures. The nanomaterial layer is formed on the first flexible circuit board, the second flexible circuit board and/or a junction region between the edge of the first flexible circuit board and the second flexible circuit board to prevent at least one of the upper metallic conductor line and the lower metallic conductor line from contacting with a specified chemical element. Consequently, the conductive impedance of the upper metallic conductor line and the lower metallic conductor line is not affected by the specified chemical element. Moreover, the present invention also provides a keyboard device with the membrane circuit board.

A circuit board assembly of an information handling system has stepped diameter vias that carry communication signals through printed circuit board (PCB) substrates. Each stepped diameter via has a first barrel portion of a first diameter that is drilled through a first portion of the PCB substrates and that is at least lined with a conductive material to electrically conduct a selected one of: (i) a direct current and (ii) a communication signal from an outer layer to an internal layer of the more than one PCB substrate. Each stepped diameter via further includes a second barrel portion that extends from the first barrel portion deeper into the PCB substrates. The second barrel portion has a second diameter that is less than the first diameter and the smaller second diameter improves signal integrity (SI).

A circuit board design device judging whether a circuit board has a pair of via holes which are adjacent within a solder bridge formation distance within which a solder bridge can be formed; when the affirmative, the circuit board design device judging whether each of the pair of via holes is electrically connected in parallel to other via hole with a land not coated with solder resist; when the circuit board design device judges that at least one of the pair of via holes is electrically connected in parallel to the other via hole with a land not coated with solder resist, the circuit board design device determining the at least one of the pair of via holes which is electrically connected in parallel to the other via hole with a land not coated with solder resist as a coated via hole with a land coated with solder resist.

A plater arrangement for filling a hole formed in a component carrier with copper is disclosed. The plater arrangement includes an electroless plater section for forming a layer of an electrically conductive material, which layer covers at least part of a surface of a wall of a component carrier and where the wall delimits the hole in the component carrier and an electro-plater section for covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper by an electro-plating process, wherein at least partially covering the layer and at least partially filling the hole is done by flash-plating. The electro-plater section having a bath for plating with copper.