A polishing slurry according to the present invention is a polishing slurry for polishing a polishing object including a resin, wherein the polishing slurry includes alumina abrasives and silica abrasives, the silica abrasives include aggregate particles composed of a plurality of primary particles of colloidal silica, and an average particle size of the primary particles is smaller than a median size of the alumina abrasives.

A polishing slurry according to the present invention is a polishing slurry for polishing copper or a copper alloy, the polishing slurry including abrasives, an organic acid, an oxidizing agent, and alkali. The polishing slurry further includes polycarboxylic acid, and alkylbenzenesulfonic acid, in which a concentration of the polycarboxylic acid is 0.1 to 0.5 mass % in terms of concentration of sodium polycarboxylate, and a concentration of the alkylbenzenesulfonic acid is 0.3 mass % or more in terms of concentration of alkylbenzenesulfonate triethanolamine.

Laminate structures and configurations of fiducials for laminates structures for electronic devices are disclosed. Fiducials are formed in laminate structures to provide increased visibility and contrast, thereby improving detection of the fiducials with optical detection equipment of automated machines commonly used in the electronics industry. Fiducials are disclosed that are defined by openings in laminate structures that extend to depths within the laminate structures to provide sufficient contrast. Openings for fiducials may be arranged to extend through multiple metal layers and dielectric layers of the laminate structures. The fiducials may be formed by laser drilling or other subtractive processing techniques. Fiducials as disclosed herein may be coated with additional layers or coatings, such as a metal coating that includes an electromagnetic shield for electronic devices, and the fiducials are configured with sufficient visibility and contrast to remain detectable through the additional layers or coatings.

The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S100 in which a material of a metal PCB 14 is prepared, a step S110 in which a circuit pattern 22 and a plurality of unit patterns 16 are formed and cut from the material of a metal PCB 14 to form a metal PCB 14, a step S120 in which a bending groove 24 is formed on a bottom surface of the metal PCB 14, a step S130 in which each of the unit patterns 16 is protruded forward around the bending groove 24 of the metal PCB 14 such that each of the unit patterns 16 is bent to be inclined from the metal PCB 14, and a step S140 in which a stepwise injection molded products 12 is coupled with the metal PCB 14 while the unit pattern 16 is protruded.

A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.

The present disclosure provides a display substrate, a method for manufacturing the display substrate, and a display device. The display substrate includes a first conductive line extending in a first direction on a base substrate, a second conductive line extending in a second direction crossing the first direction on the base substrate, and an insulation layer arranged between the first conductive line and the second conductive line. The display substrate further includes a buffer layer arranged between the first conductive line and the base substrate, a groove extending in the first direction is formed in the buffer layer, the first conductive line is arranged in the groove, and a surface of the first conductive line away from the base substrate is flush with a surface of the buffer layer away from the base substrate.

The present disclosure provides a display substrate, a method for manufacturing the display substrate, and a display device. The display substrate includes a first conductive line extending in a first direction on a base substrate, a second conductive line extending in a second direction crossing the first direction on the base substrate, and an insulation layer arranged between the first conductive line and the second conductive line. The display substrate further includes a buffer layer arranged between the first conductive line and the base substrate, a groove extending in the first direction is formed in the buffer layer, the first conductive line is arranged in the groove, and a surface of the first conductive line away from the base substrate is flush with a surface of the buffer layer away from the base substrate.

A method of manufacturing an electronic component includes applying a paste at two locations on a board main surface of a board made of alumina and applying a glass paste between the two locations, heating the board, cutting two locations where a fired layer is provided, forming a layer on an outer periphery in a vicinity of a board end surface, forming a plated layer on an outer periphery of the layer, forming a second plated layer on an outer periphery of the plated layer, providing a solder on the board main surface in a vicinity of an electronic element, and providing the electronic element on the board main surface and attaching the electronic element to an interposer board.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.