A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.

An apparatus is used in preparing a printed circuit board (PCB). The apparatus can include a common chassis, an inkjet printer mounted on the common chassis, and a pattern exposer mounted on the common chassis. The inkjet printer can selectively print unexposed photosensitive patterns on a PCB substrate with a photosensitive ink. The pattern exposer can expose said photosensitive patterns to radiation thereby defining exposed patterns. A photosensitive ink for use in an ink jet printer can include a photoresist, a solvent, a humectant, a surfactant, an adhesion promoter, and a basic solution. The adhesion promoter is operative to increase anisotropy of a wet etching process of a copper component on which said photosensitive ink is printed.

[Problem] To achieve a wiring board capable of suppressing the difference in the amount of delay between two signal wirings constituting differential signal wirings, while securing flexibility in design.

[Solution] A wiring board is configured to include a first insulating layer 1, a first signal wiring 2 and a second signal wiring 3. The first insulating layer 1 includes fibers 4 having the long axis in a first direction and aligned approximately parallel to each other at a first interval and an insulating material 5 filling gaps between the fibers 4 of the first direction. The first signal wiring 2 is formed approximately parallel to the first direction on the first insulating layer 1. The second signal wiring 3 is formed parallel to the first signal wiring 2 such that the interval between the first and second signal wirings 2 and 3 be approximately an integral multiple of the first interval, and the second signal wiring 3 transmits a differential signal of a signal transmitted on the first signal wiring 2.

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

A method for producing a wiring circuit board includes first forming a base insulating layer, and second forming a first wiring and a second wiring having different thicknesses from each other in order. The second step includes, in order, forming a seed film, forming a first resist in a reversed pattern of the first wiring on one surface in a thickness direction of the seed film, forming the first wiring on one surface in the thickness direction of the seed film by plating, removing the first resist, of forming a second resist in a reversed pattern of the second wiring on one surface in the thickness direction of the seed film to cover the first wiring, forming the second wiring on one surface in the thickness direction of the seed film by plating, removing the second resist, and removing the seed film.

Provided are a pattern formation method including a step of preparing a base material which has an etching layer transparent to an exposure wavelength on each of two surfaces thereof and is transparent to the exposure wavelength, a step of forming a photosensitive resin layer, in which an optical density to the exposure wavelength is in a range of 0.50 to 2.50, on the etching layer on each of the two surfaces of the base material, a step of pattern-exposing the photosensitive resin layer, a step of developing the photosensitive resin layer to form a resist pattern on two surfaces, a step of removing the etching layer on a portion that is not coated with the resist pattern, and a step of peeling the resist pattern off, in this order, a laminate, and a method of producing a touch panel.

A touch sensor includes a substrate, a first touch conductive layer (TCL), a first auxiliary conductive layer (ACL), a second touch conductive layer, and a second auxiliary conductive layer. The first TCL has a first touch conductive trail pattern (TCTP). The first ACL has a lower sheet resistance than the first TCL and a first auxiliary conductive trail pattern (ACTP). The second TCL has a second TCTP. The second ACL has a lower sheet resistance than the second touch conductive layer and a second ACTP. The first and second TCTPs and the first and second ACTPs jointly constitute a touch sensor.

The present disclosure provides a manufacturing method of a flat panel liquid crystal antenna, including the following steps: providing a first substrate, wherein the two sides of the first substrate are provided with a first metal film layer and a third metal film layer respectively; simultaneously patterning the metal film layer on the two sides to obtain a patterned first metal film layer and a patterned third metal film layer; providing a second substrate, wherein one side of the second substrate is provided with a second metal film layer; patterning the second metal film layer to obtain a patterned second metal film layer; and oppositely bonding the first substrate and the second substrate to form a liquid crystal cell, and preparing a liquid crystal layer. The present disclosure also provides a flat panel liquid crystal antenna by using the above method.