Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.

Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.

A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned with the mask relative to an electric field applied by the electrolytic process. The second region separates the first region of the second conductive portion from the first conductive portion. The electrolytic process is concentrated relative to the second region such that removal occurs at a relatively higher rate in the second region than in the first region.

A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned with the mask relative to an electric field applied by the electrolytic process. The second region separates the first region of the second conductive portion from the first conductive portion. The electrolytic process is concentrated relative to the second region such that removal occurs at a relatively higher rate in the second region than in the first region.

The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a color appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a coloring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.

The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a color appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a coloring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.

A chemical mechanical planarization (CMP) apparatus is provided. The CMP apparatus includes at least one platen; and a polishing pad disposed on the platen. The CMP apparatus also includes a polishing head disposed above the platen and configured to clamp a to-be-polished wafer; and a basic solution supply port disposed above the platen and configured to supply a basic solution onto a surface of the polishing pad. Further, the CMP apparatus includes a slurry arm disposed above the platen and configured to supply a polish slurry on the surface of the polishing pad; and a deionized water supply port configured to supply deionized water onto the surface of the polishing pad. Further, the CMP apparatus also includes a negative power source configured to apply a negative voltage onto the surface of the polishing pad.

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

A conductive substrate is provided that includes a transparent base material, a metal layer formed on at least one surface of the transparent base material, and a blackened layer formed on at least one surface of the transparent base material. The blackened layer contains elemental copper and/or a copper compound, and elemental nickel and a nickel compound. The nickel compound includes a nickel oxide and a nickel hydroxide.

Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.